{
  "icp": {
    "regions": [
      "global"
    ],
    "industries": [
      "communication and IT",
      "intelligent vehicles and e-mobility",
      "medical technology",
      "consumer and industrial electronics",
      "semiconductor manufacturing",
      "electronics manufacturing"
    ]
  },
  "itha": "0.1",
  "proof": {
    "customers": [
      {
        "name": "Siemens"
      },
      {
        "name": "Zollner Elektronik AG"
      },
      {
        "name": "KATEK"
      },
      {
        "name": "System Electronics"
      },
      {
        "name": "InnoSenT"
      },
      {
        "name": "micas"
      }
    ],
    "memberships": [
      {
        "name": "Semiconductor Climate Consortium"
      }
    ],
    "case_studies": [
      {
        "url": "https://smt.asmpt.com/en/news-center/case-studies/innosent-innosent-optimizes-its-material-logistics-with-software-from-asmpt/",
        "title": "InnoSenT optimizes its material logistics with software from ASMPT"
      },
      {
        "url": "https://smt.asmpt.com/en/news-center/case-studies/micas-with-flexible-production-logistics-and-placement-technology-from-asmpt/",
        "title": "micas: flexible production logistics and placement technology from ASMPT"
      },
      {
        "url": "https://smt.asmpt.com/en/news-center/case-studies/siemens-banks-on-intelligent-automation-with-asmpt/",
        "title": "Siemens Zug: Automated program changeovers error-free and manufacturer-independent"
      }
    ],
    "certifications": [
      {
        "id": "iso_9001",
        "status": "self_declared"
      },
      {
        "id": "iso_14001",
        "status": "self_declared"
      },
      {
        "id": "iso_45001",
        "status": "self_declared"
      },
      {
        "id": "iso_50001",
        "status": "self_declared"
      }
    ]
  },
  "company": {
    "hq": {
      "city": "Singapore",
      "country": "SG"
    },
    "url": "https://asmpt.com",
    "name": "ASMPT",
    "domain": "asmpt.com",
    "founded": 1975,
    "same_as": [
      "https://www.linkedin.com/company/asmpt/",
      "https://www.wikidata.org/wiki/Q55454104"
    ],
    "employees": {
      "max": 9000,
      "min": 9000
    },
    "legal_name": "ASMPT Limited",
    "description": "A global supplier of hardware and software solutions for the manufacture of semiconductors and electronics, operating through Semiconductor Solutions, SMT Solutions, and Critical Manufacturing (MES software) segments.",
    "identifiers": {
      "lei": "529900PYFA1HFYKPT360"
    }
  },
  "offerings": [
    {
      "id": "advanced-packaging",
      "url": "https://semi.asmpt.com/en/products/ap/",
      "kind": "hardware",
      "name": "Advanced Packaging",
      "role": "manufacturer",
      "summary": "Advanced-packaging equipment for semiconductor manufacturing: laser dicing/grooving, fan-out bonding, thermo-compression bonding, hybrid bonding, and ultra-high-precision die bonding."
    },
    {
      "id": "ic-discrete",
      "url": "https://semi.asmpt.com/en/products/icd/",
      "kind": "hardware",
      "name": "IC & Discrete",
      "role": "manufacturer",
      "summary": "Back-end assembly equipment for IC and discrete semiconductor devices, spanning die bonding, wire bonding, silver sintering, encapsulation, and singulation/trim/form processes."
    },
    {
      "id": "cmos-image-sensor",
      "url": "https://semi.asmpt.com/en/products/cis/",
      "kind": "hardware",
      "name": "CMOS Image Sensor Solution",
      "role": "manufacturer",
      "summary": "Packaging equipment for CMOS image sensor modules, covering die bonding, wire bonding, cleaning, AOI, lens attachment, and active alignment for consumer and automotive imaging applications."
    },
    {
      "id": "placement-solutions",
      "url": "https://smt.asmpt.com/en/products/placement-solutions/",
      "kind": "hardware",
      "name": "Placement Solutions (SIPLACE)",
      "role": "manufacturer",
      "summary": "SIPLACE surface-mount placement platforms including SIPLACE V, SX, TX, X S, and the CA2 hybrid die/SMT placement system, spanning small-batch to high-volume production."
    },
    {
      "id": "printing-solutions",
      "url": "https://smt.asmpt.com/en/products/printing-solutions/",
      "kind": "hardware",
      "name": "Printing Solutions (DEK)",
      "role": "manufacturer",
      "summary": "DEK stencil printing systems (TQ, NeoHorizon, Galaxy) for solder paste application in SMT production, with stencil cleaning, printhead paste-height control, and automatic dispensing."
    },
    {
      "id": "inspection-solutions",
      "url": "https://smt.asmpt.com/en/products/inspection-solutions/",
      "kind": "hardware",
      "name": "Inspection Solutions (Process Lens)",
      "role": "manufacturer",
      "summary": "Process Lens solder paste inspection systems using Moire phase shift technology for shadow-free 2D/3D measurement, integrable with WORKS Optimization for self-learning inline process control."
    },
    {
      "id": "works-software",
      "url": "https://smt.asmpt.com/en/products/software-solutions/",
      "kind": "software",
      "name": "WORKS Software Suite",
      "role": "manufacturer",
      "summary": "Modular shop-floor automation software comprising Planning, Logistics, Preparation, Operations, Monitoring, Optimization, Integration, and Programming applications for SMT production lines."
    },
    {
      "id": "critical-manufacturing-mes",
      "url": "https://criticalmanufacturing.com",
      "kind": "software",
      "name": "Critical Manufacturing MES",
      "role": "manufacturer",
      "summary": "MES software for semiconductor, electronics, medical device, and industrial equipment manufacturers, with execution, automation, analytics, digital twin, and AI copilot features."
    }
  ],
  "engagement": {
    "url": "https://asmpt.com/en/company/contacts/",
    "phone": "+65 6752 6311",
    "methods": [
      "consultation"
    ]
  },
  "updated_at": "2026-08-25"
}