{
  "card_url": "https://itha.ai/c/asmpt.com/card.json",
  "status": "unclaimed",
  "updated_at": "2026-08-25",
  "revision": 1,
  "provenance_url": "https://itha.ai/c/asmpt.com/provenance.json",
  "card": {
    "icp": {
      "regions": [
        "global"
      ],
      "industries": [
        "communication and IT",
        "intelligent vehicles and e-mobility",
        "medical technology",
        "consumer and industrial electronics",
        "semiconductor manufacturing",
        "electronics manufacturing"
      ]
    },
    "itha": "0.1",
    "proof": {
      "customers": [
        {
          "name": "Siemens"
        },
        {
          "name": "Zollner Elektronik AG"
        },
        {
          "name": "KATEK"
        },
        {
          "name": "System Electronics"
        },
        {
          "name": "InnoSenT"
        },
        {
          "name": "micas"
        }
      ],
      "memberships": [
        {
          "name": "Semiconductor Climate Consortium"
        }
      ],
      "case_studies": [
        {
          "url": "https://smt.asmpt.com/en/news-center/case-studies/innosent-innosent-optimizes-its-material-logistics-with-software-from-asmpt/",
          "title": "InnoSenT optimizes its material logistics with software from ASMPT"
        },
        {
          "url": "https://smt.asmpt.com/en/news-center/case-studies/micas-with-flexible-production-logistics-and-placement-technology-from-asmpt/",
          "title": "micas: flexible production logistics and placement technology from ASMPT"
        },
        {
          "url": "https://smt.asmpt.com/en/news-center/case-studies/siemens-banks-on-intelligent-automation-with-asmpt/",
          "title": "Siemens Zug: Automated program changeovers error-free and manufacturer-independent"
        }
      ],
      "certifications": [
        {
          "id": "iso_9001",
          "status": "self_declared"
        },
        {
          "id": "iso_14001",
          "status": "self_declared"
        },
        {
          "id": "iso_45001",
          "status": "self_declared"
        },
        {
          "id": "iso_50001",
          "status": "self_declared"
        }
      ]
    },
    "company": {
      "hq": {
        "city": "Singapore",
        "country": "SG"
      },
      "url": "https://asmpt.com",
      "name": "ASMPT",
      "domain": "asmpt.com",
      "founded": 1975,
      "same_as": [
        "https://www.linkedin.com/company/asmpt/",
        "https://www.wikidata.org/wiki/Q55454104"
      ],
      "employees": {
        "max": 9000,
        "min": 9000
      },
      "legal_name": "ASMPT Limited",
      "description": "A global supplier of hardware and software solutions for the manufacture of semiconductors and electronics, operating through Semiconductor Solutions, SMT Solutions, and Critical Manufacturing (MES software) segments.",
      "identifiers": {
        "lei": "529900PYFA1HFYKPT360"
      }
    },
    "offerings": [
      {
        "id": "advanced-packaging",
        "url": "https://semi.asmpt.com/en/products/ap/",
        "kind": "hardware",
        "name": "Advanced Packaging",
        "role": "manufacturer",
        "summary": "Advanced-packaging equipment for semiconductor manufacturing: laser dicing/grooving, fan-out bonding, thermo-compression bonding, hybrid bonding, and ultra-high-precision die bonding."
      },
      {
        "id": "ic-discrete",
        "url": "https://semi.asmpt.com/en/products/icd/",
        "kind": "hardware",
        "name": "IC & Discrete",
        "role": "manufacturer",
        "summary": "Back-end assembly equipment for IC and discrete semiconductor devices, spanning die bonding, wire bonding, silver sintering, encapsulation, and singulation/trim/form processes."
      },
      {
        "id": "cmos-image-sensor",
        "url": "https://semi.asmpt.com/en/products/cis/",
        "kind": "hardware",
        "name": "CMOS Image Sensor Solution",
        "role": "manufacturer",
        "summary": "Packaging equipment for CMOS image sensor modules, covering die bonding, wire bonding, cleaning, AOI, lens attachment, and active alignment for consumer and automotive imaging applications."
      },
      {
        "id": "placement-solutions",
        "url": "https://smt.asmpt.com/en/products/placement-solutions/",
        "kind": "hardware",
        "name": "Placement Solutions (SIPLACE)",
        "role": "manufacturer",
        "summary": "SIPLACE surface-mount placement platforms including SIPLACE V, SX, TX, X S, and the CA2 hybrid die/SMT placement system, spanning small-batch to high-volume production."
      },
      {
        "id": "printing-solutions",
        "url": "https://smt.asmpt.com/en/products/printing-solutions/",
        "kind": "hardware",
        "name": "Printing Solutions (DEK)",
        "role": "manufacturer",
        "summary": "DEK stencil printing systems (TQ, NeoHorizon, Galaxy) for solder paste application in SMT production, with stencil cleaning, printhead paste-height control, and automatic dispensing."
      },
      {
        "id": "inspection-solutions",
        "url": "https://smt.asmpt.com/en/products/inspection-solutions/",
        "kind": "hardware",
        "name": "Inspection Solutions (Process Lens)",
        "role": "manufacturer",
        "summary": "Process Lens solder paste inspection systems using Moire phase shift technology for shadow-free 2D/3D measurement, integrable with WORKS Optimization for self-learning inline process control."
      },
      {
        "id": "works-software",
        "url": "https://smt.asmpt.com/en/products/software-solutions/",
        "kind": "software",
        "name": "WORKS Software Suite",
        "role": "manufacturer",
        "summary": "Modular shop-floor automation software comprising Planning, Logistics, Preparation, Operations, Monitoring, Optimization, Integration, and Programming applications for SMT production lines."
      },
      {
        "id": "critical-manufacturing-mes",
        "url": "https://criticalmanufacturing.com",
        "kind": "software",
        "name": "Critical Manufacturing MES",
        "role": "manufacturer",
        "summary": "MES software for semiconductor, electronics, medical device, and industrial equipment manufacturers, with execution, automation, analytics, digital twin, and AI copilot features."
      }
    ],
    "engagement": {
      "url": "https://asmpt.com/en/company/contacts/",
      "phone": "+65 6752 6311",
      "methods": [
        "consultation"
      ]
    },
    "updated_at": "2026-08-25"
  }
}