{
  "card_url": "https://itha.ai/c/besi.com/card.json",
  "status": "unclaimed",
  "updated_at": "2026-08-24",
  "revision": 1,
  "provenance_url": "https://itha.ai/c/besi.com/provenance.json",
  "card": {
    "icp": {
      "regions": [
        "europe",
        "apac",
        "north_america"
      ],
      "industries": [
        "electronics",
        "mobile internet",
        "cloud server",
        "computing",
        "automotive",
        "industrial",
        "LED",
        "solar energy"
      ]
    },
    "itha": "0.1",
    "company": {
      "hq": {
        "city": "Duiven",
        "country": "NL"
      },
      "url": "https://www.besi.com",
      "name": "Besi",
      "domain": "besi.com",
      "founded": 1995,
      "same_as": [
        "https://www.linkedin.com/company/be-semiconductor-industries-n.v./",
        "https://www.wikidata.org/wiki/Q48988067"
      ],
      "employees": {
        "max": 1870,
        "min": 1870
      },
      "legal_name": "BE Semiconductor Industries N.V.",
      "description": "Develops, manufactures, markets, sells and services semiconductor assembly equipment for the global semiconductor and electronics industries, covering leadframe, substrate and wafer level packaging applications.",
      "identifiers": {
        "lei": "7245007A1YFLI2GNYX06"
      }
    },
    "offerings": [
      {
        "id": "die-attach",
        "url": "https://www.besi.com/products-technology/productgroup/die-attach/",
        "kind": "hardware",
        "name": "Die Attach",
        "role": "manufacturer",
        "pricing": {
          "model": "quote"
        },
        "summary": "Die attach systems for leadframe, substrate and wafer level packaging, including flip chip and hybrid bonding, sold under the Datacon and Esec brands."
      },
      {
        "id": "packaging",
        "url": "https://www.besi.com/products-technology/productgroup/packaging/",
        "kind": "hardware",
        "name": "Packaging",
        "role": "manufacturer",
        "pricing": {
          "model": "quote"
        },
        "summary": "Molding, trim & form and singulation systems for semiconductor packaging, marketed under the Fico brand name."
      },
      {
        "id": "plating-cleaning",
        "url": "https://www.besi.com/products-technology/productgroup/plating-cleaning/",
        "kind": "hardware",
        "name": "Plating & Cleaning",
        "role": "manufacturer",
        "pricing": {
          "model": "quote"
        },
        "summary": "Continuous plating and leadframe cleaning systems for leadframe, connector, solar, and film and foil plating applications, marketed under the Meco brand name."
      },
      {
        "id": "after-sales",
        "url": "https://www.besi.com/after-sales",
        "kind": "service",
        "name": "After Sales Support",
        "role": "manufacturer",
        "summary": "Customer service and spare parts and tooling support for installed Besi equipment, provided through service centers in Asia, Europe and the US with day and night response."
      }
    ],
    "engagement": {
      "url": "https://www.besi.com/contact-us/contact-form/",
      "phone": "+31 26 319 4500",
      "methods": [
        "quote_request",
        "consultation"
      ]
    },
    "updated_at": "2026-08-24"
  }
}