{
  "icp": {
    "regions": [
      "DE",
      "US",
      "TW",
      "JP",
      "CN",
      "AU",
      "KR",
      "CZ",
      "MY"
    ],
    "industries": [
      "industrial automation",
      "medical technology",
      "robotics",
      "telecommunications",
      "infrastructure",
      "building automation",
      "energy",
      "transport systems",
      "IIoT and Industry 4.0",
      "test and measurement technology"
    ]
  },
  "itha": "0.1",
  "proof": {
    "memberships": [
      {
        "name": "PICMG (PCI Industrial Computer Manufacturing Group)"
      },
      {
        "name": "SGET (Standardization Group for Embedded Technologies)"
      }
    ],
    "certifications": [
      {
        "id": "iso_9001",
        "status": "self_declared"
      },
      {
        "id": "iso_14001",
        "status": "self_declared"
      },
      {
        "id": "iso_27001",
        "status": "self_declared"
      },
      {
        "id": "iso_37301",
        "status": "self_declared"
      }
    ]
  },
  "company": {
    "hq": {
      "city": "Deggendorf",
      "country": "DE"
    },
    "url": "https://www.congatec.com/en/",
    "name": "congatec",
    "domain": "congatec.com",
    "founded": 2004,
    "same_as": [
      "https://www.linkedin.com/company/congatec/",
      "https://www.wikidata.org/wiki/Q67439614"
    ],
    "employees": {
      "min": 500
    },
    "legal_name": "congatec GmbH",
    "description": "Provider of high-performance hardware and software building blocks for embedded and edge computing solutions based on Computer-on-Modules (COMs), serving industrial automation, medical technology, robotics and telecommunications markets among others.",
    "identifiers": {
      "lei": "9845005FWC5CE4B7E023",
      "vat_id": "DE335918343"
    }
  },
  "offerings": [
    {
      "id": "com-hpc",
      "icp": {
        "use_cases": [
          "infrastructure",
          "robotics",
          "medical technology",
          "industrial automation",
          "IIoT/Industry 4.0"
        ]
      },
      "url": "https://www.congatec.com/en/technologies/com-hpc.html",
      "kind": "hardware",
      "name": "COM-HPC Ecosystem",
      "role": "manufacturer",
      "summary": "COM-HPC standard Computer-on-Modules (Mini, Client, Server form factors) supporting x86, ARM, GPUs, ASICs and FPGAs for high-bandwidth edge and embedded server applications."
    },
    {
      "id": "com-express",
      "icp": {
        "use_cases": [
          "infrastructure",
          "robotics",
          "medical technology",
          "industrial automation",
          "transport systems"
        ]
      },
      "url": "https://www.congatec.com/en/technologies/com-express.html",
      "kind": "hardware",
      "name": "COM Express Ecosystem",
      "role": "manufacturer",
      "summary": "COM Express standard Computer-on-Modules (Mini, Compact, Basic, Extended form factors) with Intel Core Ultra, Atom/Pentium/Celeron and AMD Ryzen Embedded processors, up to 128GB DDR5 memory."
    },
    {
      "id": "smarc",
      "icp": {
        "use_cases": [
          "robotics",
          "autonomous mobile robots",
          "embedded vision",
          "medical technology",
          "industrial automation"
        ]
      },
      "url": "https://www.congatec.com/en/technologies/smarc.html",
      "kind": "hardware",
      "name": "SMARC Ecosystem",
      "role": "manufacturer",
      "summary": "SMARC 2.1 credit-card-sized Computer-on-Modules (82x50mm, up to 25W) with NXP i.MX, Intel Atom and TI processors, for size- and power-constrained AI edge applications."
    },
    {
      "id": "qseven",
      "icp": {
        "use_cases": [
          "robotics",
          "medical devices",
          "edge computing",
          "industrial automation",
          "building automation"
        ]
      },
      "url": "https://www.congatec.com/en/technologies/qseven.html",
      "kind": "hardware",
      "name": "Qseven Ecosystem",
      "role": "manufacturer",
      "summary": "Qseven mobile Computer-on-Modules (70x70mm or 40x70mm micro variant, up to 12W) with NXP i.MX and Intel Atom/Pentium/Celeron processors for rugged ultra-mobile embedded designs."
    },
    {
      "id": "sbc",
      "icp": {
        "use_cases": [
          "infrastructure",
          "robotics",
          "medical technology",
          "industrial automation",
          "IIoT/Industry 4.0"
        ]
      },
      "url": "https://www.congatec.com/en/ecosystems/sbc-ecosystem/",
      "kind": "hardware",
      "name": "SBC Ecosystem",
      "role": "manufacturer",
      "summary": "Single board computers including the Pico-ITX conga-PA7 based on Intel Atom x6000E, Pentium and Celeron J processors, for edge applications requiring industrial reliability and low power."
    },
    {
      "id": "aready",
      "icp": {
        "use_cases": [
          "infrastructure",
          "robotics",
          "medical technology",
          "industrial automation",
          "digital signage"
        ]
      },
      "url": "https://www.congatec.com/en/aready/aready-overview/",
      "kind": "software",
      "name": "aReady.",
      "summary": "aReady application-ready building blocks combining Computer-on-Modules (aReady.COM), virtualization (aReady.VT), IoT connectivity (aReady.IOT) and a certified system integration service."
    }
  ],
  "engagement": {
    "url": "https://www.congatec.com/en/contact/",
    "email": "info@congatec.com",
    "phone": "+49 (991) 2700-0",
    "methods": [
      "consultation"
    ]
  },
  "updated_at": "2026-09-01"
}