{
  "icp": {
    "regions": [
      "global"
    ],
    "industries": [
      "semiconductor manufacturing",
      "memory chip packaging"
    ]
  },
  "itha": "0.1",
  "proof": {
    "certifications": [
      {
        "id": "iso_9001",
        "status": "self_declared"
      },
      {
        "id": "ce",
        "status": "self_declared"
      }
    ]
  },
  "company": {
    "hq": {
      "city": "Incheon",
      "country": "KR"
    },
    "url": "https://www.hanmisemi.com/en/",
    "name": "HANMI Semiconductor",
    "domain": "hanmisemi.com",
    "founded": 1980,
    "same_as": [
      "https://www.linkedin.com/company/hanmi-semiconductor",
      "https://www.wikidata.org/wiki/Q131188043"
    ],
    "employees": {
      "max": 1000,
      "min": 501
    },
    "legal_name": "HANMI Semiconductor Co., Ltd.",
    "description": "HANMI Semiconductor manufactures semiconductor assembly and packaging equipment, including thermal-compression bonders, flip-chip bonders, vision placement systems, micro saw equipment, EMI shield equipment, grinders and laser systems for semiconductor back-end processing."
  },
  "offerings": [
    {
      "id": "hbm",
      "url": "https://www.hanmisemi.com/en/product/index.html",
      "kind": "hardware",
      "name": "HBM TC Bonder",
      "role": "manufacturer",
      "summary": "Thermal-compression bonding equipment for stacking high bandwidth memory (HBM) dies, including Dual TC Bonder Dragon, Griffin and Tiger models and a dedicated HBM 6-side inspection system.",
      "channels": [
        "direct",
        "distributors"
      ]
    },
    {
      "id": "bonder",
      "url": "https://hanmisemi.com/index.php?action=SiteProductEn&module=Html&sSubNo=3",
      "kind": "hardware",
      "name": "TC Bonder / FC Bonder",
      "role": "manufacturer",
      "summary": "Thermal-compression and flip-chip bonding systems for semiconductor die and package assembly, spanning the 3.0 to 8.0 model series and multi-die and big-die variants.",
      "channels": [
        "direct",
        "distributors"
      ]
    },
    {
      "id": "vision-placement",
      "url": "https://www.hanmisemi.com/en/product/index.html",
      "kind": "hardware",
      "name": "Vision Placement",
      "role": "manufacturer",
      "summary": "Vision-guided die/package placement systems in the 6.0 and 8.0 series, including Griffin, D, L, T Fast, UD, UL and PS model variants used in semiconductor package assembly.",
      "channels": [
        "direct",
        "distributors"
      ],
      "extensions": {
        "robotics": {
          "category": "vision_system",
          "spec_version": "0.1"
        }
      }
    },
    {
      "id": "micro-saw",
      "url": "https://www.hanmisemi.com/en/product/index.html",
      "kind": "hardware",
      "name": "micro SAW",
      "role": "manufacturer",
      "summary": "Sawing equipment for cutting semiconductor packages, offered in eight models (W1121α, T2101, T1121, P2101, PL1121, PL1201, PL1241, GL2101).",
      "channels": [
        "direct",
        "distributors"
      ]
    },
    {
      "id": "emi-shield",
      "url": "https://www.hanmisemi.com/en/product/index.html",
      "kind": "hardware",
      "name": "EMI Shield",
      "role": "manufacturer",
      "summary": "Equipment for applying and removing EMI shielding on semiconductor packages, including the EMI Shield Vision Attach 2.0 Dragon and related tape-handling systems.",
      "channels": [
        "direct",
        "distributors"
      ]
    },
    {
      "id": "meta-grinder",
      "url": "https://www.hanmisemi.com/en/product/index.html",
      "kind": "hardware",
      "name": "Meta Grinder",
      "role": "manufacturer",
      "summary": "Grinding equipment for semiconductor package processing.",
      "channels": [
        "direct",
        "distributors"
      ]
    },
    {
      "id": "laser",
      "url": "https://www.hanmisemi.com/en/product/index.html",
      "kind": "hardware",
      "name": "Laser Systems",
      "role": "manufacturer",
      "summary": "Laser ablation and laser marking equipment for semiconductor package processing.",
      "channels": [
        "direct",
        "distributors"
      ]
    }
  ],
  "engagement": {
    "url": "https://www.hanmisemi.com/en/",
    "phone": "+82-32-571-9100",
    "methods": [
      "consultation"
    ]
  },
  "updated_at": "2026-09-01"
}