{
  "card_url": "https://itha.ai/c/hanmisemi.com/card.json",
  "status": "unclaimed",
  "updated_at": "2026-09-01",
  "revision": 1,
  "provenance_url": "https://itha.ai/c/hanmisemi.com/provenance.json",
  "card": {
    "icp": {
      "regions": [
        "global"
      ],
      "industries": [
        "semiconductor manufacturing",
        "memory chip packaging"
      ]
    },
    "itha": "0.1",
    "proof": {
      "certifications": [
        {
          "id": "iso_9001",
          "status": "self_declared"
        },
        {
          "id": "ce",
          "status": "self_declared"
        }
      ]
    },
    "company": {
      "hq": {
        "city": "Incheon",
        "country": "KR"
      },
      "url": "https://www.hanmisemi.com/en/",
      "name": "HANMI Semiconductor",
      "domain": "hanmisemi.com",
      "founded": 1980,
      "same_as": [
        "https://www.linkedin.com/company/hanmi-semiconductor",
        "https://www.wikidata.org/wiki/Q131188043"
      ],
      "employees": {
        "max": 1000,
        "min": 501
      },
      "legal_name": "HANMI Semiconductor Co., Ltd.",
      "description": "HANMI Semiconductor manufactures semiconductor assembly and packaging equipment, including thermal-compression bonders, flip-chip bonders, vision placement systems, micro saw equipment, EMI shield equipment, grinders and laser systems for semiconductor back-end processing."
    },
    "offerings": [
      {
        "id": "hbm",
        "url": "https://www.hanmisemi.com/en/product/index.html",
        "kind": "hardware",
        "name": "HBM TC Bonder",
        "role": "manufacturer",
        "summary": "Thermal-compression bonding equipment for stacking high bandwidth memory (HBM) dies, including Dual TC Bonder Dragon, Griffin and Tiger models and a dedicated HBM 6-side inspection system.",
        "channels": [
          "direct",
          "distributors"
        ]
      },
      {
        "id": "bonder",
        "url": "https://hanmisemi.com/index.php?action=SiteProductEn&module=Html&sSubNo=3",
        "kind": "hardware",
        "name": "TC Bonder / FC Bonder",
        "role": "manufacturer",
        "summary": "Thermal-compression and flip-chip bonding systems for semiconductor die and package assembly, spanning the 3.0 to 8.0 model series and multi-die and big-die variants.",
        "channels": [
          "direct",
          "distributors"
        ]
      },
      {
        "id": "vision-placement",
        "url": "https://www.hanmisemi.com/en/product/index.html",
        "kind": "hardware",
        "name": "Vision Placement",
        "role": "manufacturer",
        "summary": "Vision-guided die/package placement systems in the 6.0 and 8.0 series, including Griffin, D, L, T Fast, UD, UL and PS model variants used in semiconductor package assembly.",
        "channels": [
          "direct",
          "distributors"
        ],
        "extensions": {
          "robotics": {
            "category": "vision_system",
            "spec_version": "0.1"
          }
        }
      },
      {
        "id": "micro-saw",
        "url": "https://www.hanmisemi.com/en/product/index.html",
        "kind": "hardware",
        "name": "micro SAW",
        "role": "manufacturer",
        "summary": "Sawing equipment for cutting semiconductor packages, offered in eight models (W1121α, T2101, T1121, P2101, PL1121, PL1201, PL1241, GL2101).",
        "channels": [
          "direct",
          "distributors"
        ]
      },
      {
        "id": "emi-shield",
        "url": "https://www.hanmisemi.com/en/product/index.html",
        "kind": "hardware",
        "name": "EMI Shield",
        "role": "manufacturer",
        "summary": "Equipment for applying and removing EMI shielding on semiconductor packages, including the EMI Shield Vision Attach 2.0 Dragon and related tape-handling systems.",
        "channels": [
          "direct",
          "distributors"
        ]
      },
      {
        "id": "meta-grinder",
        "url": "https://www.hanmisemi.com/en/product/index.html",
        "kind": "hardware",
        "name": "Meta Grinder",
        "role": "manufacturer",
        "summary": "Grinding equipment for semiconductor package processing.",
        "channels": [
          "direct",
          "distributors"
        ]
      },
      {
        "id": "laser",
        "url": "https://www.hanmisemi.com/en/product/index.html",
        "kind": "hardware",
        "name": "Laser Systems",
        "role": "manufacturer",
        "summary": "Laser ablation and laser marking equipment for semiconductor package processing.",
        "channels": [
          "direct",
          "distributors"
        ]
      }
    ],
    "engagement": {
      "url": "https://www.hanmisemi.com/en/",
      "phone": "+82-32-571-9100",
      "methods": [
        "consultation"
      ]
    },
    "updated_at": "2026-09-01"
  }
}