{
  "icp": {
    "regions": [
      "global"
    ],
    "industries": [
      "automotive",
      "compute",
      "industrial",
      "memory",
      "communications"
    ]
  },
  "itha": "0.1",
  "company": {
    "hq": {
      "city": "Singapore",
      "country": "SG"
    },
    "url": "https://www.kns.com",
    "name": "Kulicke & Soffa",
    "domain": "kns.com",
    "founded": 1951,
    "same_as": [
      "https://www.linkedin.com/company/kulickesoffa",
      "https://www.wikidata.org/wiki/Q17063707"
    ],
    "employees": {
      "max": 2550,
      "min": 2550
    },
    "legal_name": "Kulicke and Soffa Industries, Inc.",
    "description": "Semiconductor assembly equipment manufacturer providing wire bonding, advanced packaging, dispensing, and related capital equipment and consumables for automotive, compute, industrial, memory and communications markets."
  },
  "offerings": [
    {
      "id": "ball-bonder",
      "url": "https://www.kns.com/products-services/ball-bonder",
      "kind": "hardware",
      "name": "Ball Bonder",
      "role": "manufacturer",
      "summary": "Ball bonders for semiconductor wire bonding assembly, with automation designed for integration into Industry 4.0 production environments."
    },
    {
      "id": "wedge-bonder",
      "url": "https://www.kns.com/products-services/wedge-bonder",
      "kind": "hardware",
      "name": "Wedge Bonder",
      "role": "manufacturer",
      "summary": "Wedge bonders for wire and ribbon bonding in power semiconductors, automotive power modules, and industrial power hybrids."
    },
    {
      "id": "advanced-packaging",
      "url": "https://www.kns.com/products-services/advanced-packaging",
      "kind": "hardware",
      "name": "Advanced Packaging",
      "role": "manufacturer",
      "summary": "Thermo-compression bonding systems for wafer-level to panel-level packaging, supporting fluxless heterogeneous integration in semiconductor assembly."
    },
    {
      "id": "advanced-dispensing",
      "url": "https://www.kns.com/products-services/advanced-dispensing",
      "kind": "hardware",
      "name": "Advanced Dispensing",
      "role": "manufacturer",
      "summary": "Dispensing and coating systems for semiconductor and microelectronics production, combining automated dispensing with process control."
    },
    {
      "id": "wafer-level-bonder",
      "url": "https://www.kns.com/products-services/wafer-level-bonder",
      "kind": "hardware",
      "name": "Wafer Level Bonder",
      "role": "manufacturer",
      "summary": "Wafer-level bonding equipment supporting wire bonding and vertical bonding applications in wafer-level packaging production."
    },
    {
      "id": "advanced-power-assembly",
      "url": "https://www.kns.com/products-services/advanced-power-assembly",
      "kind": "hardware",
      "name": "Advanced Power Assembly",
      "role": "manufacturer",
      "summary": "Assembly equipment for high-power, wide-bandgap semiconductor devices, used in automotive, renewable energy, and power electronics manufacturing."
    },
    {
      "id": "capillaries",
      "url": "https://www.kns.com/products-services/capillaries",
      "kind": "consumable",
      "name": "Capillaries",
      "role": "manufacturer",
      "summary": "Bonding capillaries for wire bonding equipment, offered in standard and customized designs for semiconductor packaging applications."
    },
    {
      "id": "ks-care",
      "url": "https://www.kns.com/products-services/ks-care",
      "kind": "service",
      "name": "K&S Care",
      "role": "manufacturer",
      "summary": "Equipment maintenance service for K&S machines performed by K&S engineers, offered in Basic, Professional, and Comprehensive coverage tiers."
    }
  ],
  "engagement": {
    "url": "https://www.kns.com/contact",
    "email": "custserv@kns.com"
  },
  "updated_at": "2026-08-24"
}