{
  "icp": {
    "regions": [
      "global"
    ],
    "use_cases": [
      "die attach",
      "wire bonding",
      "vacuum reflow soldering",
      "hermetic package sealing"
    ],
    "industries": [
      "Automotive",
      "Lasers",
      "LEDs",
      "Medical & Bio Photonics",
      "Military, High Reliability & MEMS",
      "Photonics",
      "Power Semiconductors",
      "RF, Microwave & Wireless",
      "Sensors",
      "Telecom, 5G & Datacom"
    ]
  },
  "itha": "0.1",
  "proof": {
    "memberships": [
      {
        "url": "https://www.palomartechnologies.com/about-us/corporate/industry-excellence/certifications",
        "name": "SEMI"
      },
      {
        "url": "https://www.palomartechnologies.com/about-us/corporate/industry-excellence/certifications",
        "name": "SMTA"
      },
      {
        "url": "https://www.palomartechnologies.com/about-us/corporate/industry-excellence/certifications",
        "name": "iMAPS (International Microelectronics Assembly and Packaging Society)"
      }
    ],
    "certifications": [
      {
        "id": "iso_9001",
        "issuer": "SGS North America, Inc.",
        "status": "third_party_certified",
        "evidence_url": "https://www.palomartechnologies.com/news-room/press-releases/palomar-technologies-awarded-iso-90012015-certificate"
      },
      {
        "id": "itar",
        "status": "self_declared",
        "evidence_url": "https://www.palomartechnologies.com/news-room/press-releases/bid/67345/palomar-technologies-meets-and-exceeds-itar-compliance-regulations"
      }
    ]
  },
  "company": {
    "hq": {
      "city": "Carlsbad",
      "region": "California",
      "country": "US"
    },
    "url": "https://www.palomartechnologies.com/",
    "name": "Palomar Technologies",
    "domain": "palomartechnologies.com",
    "founded": 1995,
    "same_as": [
      "https://www.linkedin.com/company/palomar-technologies"
    ],
    "description": "Supplies automated microelectronic assembly machines and contract assembly services specializing in precision die attach, wire bonding and vacuum reflow solutions for the semiconductor and photonics industries."
  },
  "offerings": [
    {
      "id": "die-bonders",
      "url": "https://www.palomartechnologies.com/product/",
      "kind": "hardware",
      "name": "Die Bonders",
      "role": "manufacturer",
      "pricing": {
        "model": "quote"
      },
      "summary": "Automated die attach systems for microelectronic and photonic device packaging, supporting epoxy, UV, solder paste, eutectic, silver sintering, and thermocompression die attach processes.",
      "channels": [
        "direct"
      ]
    },
    {
      "id": "wire-wedge-bonders",
      "url": "https://www.palomartechnologies.com/product/",
      "kind": "hardware",
      "name": "Wire & Wedge Bonders",
      "role": "manufacturer",
      "pricing": {
        "model": "quote"
      },
      "summary": "Automated wire and wedge bonding equipment for microelectronic device packaging.",
      "channels": [
        "direct"
      ]
    },
    {
      "id": "vacuum-reflow-systems",
      "url": "https://www.palomartechnologies.com/product/8300-series-automated-vacuum-pressure",
      "kind": "hardware",
      "name": "SST Vacuum Reflow Systems",
      "role": "manufacturer",
      "pricing": {
        "model": "quote"
      },
      "summary": "Automated vacuum pressure soldering and reflow furnaces for flux-less die attach and power module assembly, heating up to 500°C under vacuum.",
      "channels": [
        "direct"
      ]
    },
    {
      "id": "high-vacuum-furnaces",
      "url": "https://www.palomartechnologies.com/product/3150-high-vacuum-furnace",
      "kind": "hardware",
      "name": "SST High Vacuum Furnaces",
      "role": "manufacturer",
      "pricing": {
        "model": "quote"
      },
      "summary": "High vacuum furnaces for hermetic sealing of MEMS, infrared sensor, and wafer-level packages, reaching vacuum levels as low as 10-7 Torr and temperatures up to 500°C (1000°C optional).",
      "channels": [
        "direct"
      ]
    },
    {
      "id": "advanced-solutions-division",
      "url": "https://www.palomartechnologies.com/innovation-centers",
      "kind": "service",
      "name": "Advanced Solutions Division",
      "role": "manufacturer",
      "pricing": {
        "model": "quote"
      },
      "summary": "Contract manufacturing and outsourced semiconductor assembly and test services, including process development, package prototyping, and production for die attach, wire bonding, and vacuum reflow.",
      "channels": [
        "direct"
      ]
    }
  ],
  "engagement": {
    "url": "https://www.palomartechnologies.com/contact-us",
    "email": "sales@bonders.com",
    "phone": "+1 (760) 931-3600",
    "methods": [
      "quote_request",
      "consultation"
    ]
  },
  "updated_at": "2026-09-04"
}