{
  "icp": {
    "regions": [
      "apac",
      "europe",
      "north_america",
      "latin_america"
    ],
    "use_cases": [
      "Solder paste print inspection on SMT lines",
      "Post-reflow and through-hole optical inspection",
      "X-ray solder joint and void inspection",
      "IGBT and power module quality inspection"
    ],
    "industries": [
      "Electronics manufacturing (EMS/OEM)",
      "PCB assembly",
      "Power semiconductor / power module manufacturing",
      "Semiconductor packaging"
    ]
  },
  "itha": "0.1",
  "proof": {
    "customers": [
      {
        "url": "https://www.sakicorp.com/use-case/alpsalpine/",
        "name": "Alps Alpine"
      },
      {
        "url": "https://www.sakicorp.com/use-case/tq-group/",
        "name": "TQ-Group"
      },
      {
        "url": "https://www.sakicorp.com/use-case/rohde-schwarz/",
        "name": "Rohde & Schwarz"
      },
      {
        "url": "https://www.sakicorp.com/use-case/smart-modular-technologies/",
        "name": "Smart Modular Technologies"
      }
    ],
    "certifications": [
      {
        "id": "iso_9001",
        "status": "self_declared"
      },
      {
        "id": "iso_14001",
        "status": "self_declared"
      }
    ]
  },
  "company": {
    "hq": {
      "city": "Koto-ku",
      "region": "Tokyo",
      "country": "JP"
    },
    "url": "https://www.sakicorp.com/en/",
    "name": "SAKI Corporation",
    "domain": "sakicorp.com",
    "founded": 1994,
    "same_as": [
      "https://www.linkedin.com/company/saki-corporation"
    ],
    "legal_name": "株式会社サキコーポレーション",
    "description": "SAKI manufactures automated optical and X-ray inspection equipment for printed circuit board assemblies, semiconductor packages, and power modules, replacing manual visual inspection with automated imaging analysis."
  },
  "offerings": [
    {
      "id": "3d-spi",
      "url": "https://www.sakicorp.com/product/3d-spi/?cat=smt",
      "kind": "hardware",
      "name": "3D-SPI",
      "role": "manufacturer",
      "summary": "3D solder paste inspection system for SMT solder-printing inspection, measuring paste area, height, and volume and detecting bridges, spikes, and BGA coplanarity defects.",
      "channels": [
        "direct",
        "distributors"
      ],
      "extensions": {
        "robotics": {
          "category": "vision_system",
          "applications": [
            "inspection"
          ],
          "spec_version": "0.1"
        }
      }
    },
    {
      "id": "3d-aoi",
      "url": "https://www.sakicorp.com/product/3d-aoi/?cat=smt",
      "kind": "hardware",
      "name": "3D-AOI",
      "role": "manufacturer",
      "summary": "3D automated optical inspection system for SMT and through-hole assembly, covering high-density boards, small components, and mixed tall-component boards.",
      "channels": [
        "direct",
        "distributors"
      ],
      "extensions": {
        "robotics": {
          "category": "vision_system",
          "applications": [
            "inspection"
          ],
          "spec_version": "0.1"
        }
      }
    },
    {
      "id": "3d-ct-axi",
      "url": "https://www.sakicorp.com/product/3d-ct-axi/?cat=smt",
      "kind": "hardware",
      "name": "3D-CT AXI",
      "role": "manufacturer",
      "summary": "Inline 3D X-ray automated inspection system using proprietary planar-CT imaging for SMT and through-hole solder joint inspection, including BGA head-in-pillow/void detection and bridge defects.",
      "channels": [
        "direct",
        "distributors"
      ],
      "extensions": {
        "robotics": {
          "category": "vision_system",
          "applications": [
            "inspection"
          ],
          "spec_version": "0.1"
        }
      }
    },
    {
      "id": "bottomside-aoi",
      "url": "https://www.sakicorp.com/product/bottomside-aoi/",
      "kind": "hardware",
      "name": "BottomSide-AOI",
      "role": "manufacturer",
      "summary": "2D bottom-side optical inspection system (model 2Di-LU1) that verifies through-hole solder quality after selective, flow, or dip soldering without requiring board flipping.",
      "channels": [
        "direct",
        "distributors"
      ],
      "extensions": {
        "robotics": {
          "category": "vision_system",
          "applications": [
            "inspection"
          ],
          "spec_version": "0.1"
        }
      }
    },
    {
      "id": "power-module-axi",
      "url": "https://www.sakicorp.com/product/igbt-power-module-axi/?cat=semiconductor",
      "kind": "hardware",
      "name": "Power Module-AXI",
      "role": "manufacturer",
      "summary": "3D-CT X-ray inspection system for IGBT and DSC power modules, using planar-CT imaging to separate solder layers and detect voids, with noise cancellation for heat-fin artifacts.",
      "channels": [
        "direct",
        "distributors"
      ],
      "extensions": {
        "robotics": {
          "category": "vision_system",
          "applications": [
            "inspection"
          ],
          "spec_version": "0.1"
        }
      }
    }
  ],
  "engagement": {
    "url": "https://www.sakicorp.com/contact/product/",
    "methods": [
      "quote_request",
      "demo"
    ]
  },
  "extensions": {
    "robotics": {
      "roles": [
        "equipment_manufacturer"
      ],
      "service_area": [
        "global"
      ],
      "spec_version": "0.1"
    }
  },
  "updated_at": "2026-09-04"
}