{
  "card_url": "https://itha.ai/c/sakicorp.com/card.json",
  "status": "unclaimed",
  "updated_at": "2026-09-04",
  "revision": 1,
  "provenance_url": "https://itha.ai/c/sakicorp.com/provenance.json",
  "card": {
    "icp": {
      "regions": [
        "apac",
        "europe",
        "north_america",
        "latin_america"
      ],
      "use_cases": [
        "Solder paste print inspection on SMT lines",
        "Post-reflow and through-hole optical inspection",
        "X-ray solder joint and void inspection",
        "IGBT and power module quality inspection"
      ],
      "industries": [
        "Electronics manufacturing (EMS/OEM)",
        "PCB assembly",
        "Power semiconductor / power module manufacturing",
        "Semiconductor packaging"
      ]
    },
    "itha": "0.1",
    "proof": {
      "customers": [
        {
          "url": "https://www.sakicorp.com/use-case/alpsalpine/",
          "name": "Alps Alpine"
        },
        {
          "url": "https://www.sakicorp.com/use-case/tq-group/",
          "name": "TQ-Group"
        },
        {
          "url": "https://www.sakicorp.com/use-case/rohde-schwarz/",
          "name": "Rohde & Schwarz"
        },
        {
          "url": "https://www.sakicorp.com/use-case/smart-modular-technologies/",
          "name": "Smart Modular Technologies"
        }
      ],
      "certifications": [
        {
          "id": "iso_9001",
          "status": "self_declared"
        },
        {
          "id": "iso_14001",
          "status": "self_declared"
        }
      ]
    },
    "company": {
      "hq": {
        "city": "Koto-ku",
        "region": "Tokyo",
        "country": "JP"
      },
      "url": "https://www.sakicorp.com/en/",
      "name": "SAKI Corporation",
      "domain": "sakicorp.com",
      "founded": 1994,
      "same_as": [
        "https://www.linkedin.com/company/saki-corporation"
      ],
      "legal_name": "株式会社サキコーポレーション",
      "description": "SAKI manufactures automated optical and X-ray inspection equipment for printed circuit board assemblies, semiconductor packages, and power modules, replacing manual visual inspection with automated imaging analysis."
    },
    "offerings": [
      {
        "id": "3d-spi",
        "url": "https://www.sakicorp.com/product/3d-spi/?cat=smt",
        "kind": "hardware",
        "name": "3D-SPI",
        "role": "manufacturer",
        "summary": "3D solder paste inspection system for SMT solder-printing inspection, measuring paste area, height, and volume and detecting bridges, spikes, and BGA coplanarity defects.",
        "channels": [
          "direct",
          "distributors"
        ],
        "extensions": {
          "robotics": {
            "category": "vision_system",
            "applications": [
              "inspection"
            ],
            "spec_version": "0.1"
          }
        }
      },
      {
        "id": "3d-aoi",
        "url": "https://www.sakicorp.com/product/3d-aoi/?cat=smt",
        "kind": "hardware",
        "name": "3D-AOI",
        "role": "manufacturer",
        "summary": "3D automated optical inspection system for SMT and through-hole assembly, covering high-density boards, small components, and mixed tall-component boards.",
        "channels": [
          "direct",
          "distributors"
        ],
        "extensions": {
          "robotics": {
            "category": "vision_system",
            "applications": [
              "inspection"
            ],
            "spec_version": "0.1"
          }
        }
      },
      {
        "id": "3d-ct-axi",
        "url": "https://www.sakicorp.com/product/3d-ct-axi/?cat=smt",
        "kind": "hardware",
        "name": "3D-CT AXI",
        "role": "manufacturer",
        "summary": "Inline 3D X-ray automated inspection system using proprietary planar-CT imaging for SMT and through-hole solder joint inspection, including BGA head-in-pillow/void detection and bridge defects.",
        "channels": [
          "direct",
          "distributors"
        ],
        "extensions": {
          "robotics": {
            "category": "vision_system",
            "applications": [
              "inspection"
            ],
            "spec_version": "0.1"
          }
        }
      },
      {
        "id": "bottomside-aoi",
        "url": "https://www.sakicorp.com/product/bottomside-aoi/",
        "kind": "hardware",
        "name": "BottomSide-AOI",
        "role": "manufacturer",
        "summary": "2D bottom-side optical inspection system (model 2Di-LU1) that verifies through-hole solder quality after selective, flow, or dip soldering without requiring board flipping.",
        "channels": [
          "direct",
          "distributors"
        ],
        "extensions": {
          "robotics": {
            "category": "vision_system",
            "applications": [
              "inspection"
            ],
            "spec_version": "0.1"
          }
        }
      },
      {
        "id": "power-module-axi",
        "url": "https://www.sakicorp.com/product/igbt-power-module-axi/?cat=semiconductor",
        "kind": "hardware",
        "name": "Power Module-AXI",
        "role": "manufacturer",
        "summary": "3D-CT X-ray inspection system for IGBT and DSC power modules, using planar-CT imaging to separate solder layers and detect voids, with noise cancellation for heat-fin artifacts.",
        "channels": [
          "direct",
          "distributors"
        ],
        "extensions": {
          "robotics": {
            "category": "vision_system",
            "applications": [
              "inspection"
            ],
            "spec_version": "0.1"
          }
        }
      }
    ],
    "engagement": {
      "url": "https://www.sakicorp.com/contact/product/",
      "methods": [
        "quote_request",
        "demo"
      ]
    },
    "extensions": {
      "robotics": {
        "roles": [
          "equipment_manufacturer"
        ],
        "service_area": [
          "global"
        ],
        "spec_version": "0.1"
      }
    },
    "updated_at": "2026-09-04"
  }
}