{
  "itha": "0.2",
  "proof": {
    "certifications": [
      {
        "id": "iso_9001",
        "status": "self_declared",
        "evidence_url": "https://tazmo.co.jp/en/company/"
      },
      {
        "id": "iso_14001",
        "status": "self_declared",
        "evidence_url": "https://tazmo.co.jp/en/company/"
      }
    ]
  },
  "company": {
    "hq": {
      "city": "Okayama",
      "region": "Okayama",
      "country": "JP"
    },
    "url": "https://tazmo.co.jp/en/",
    "name": "TAZMO",
    "domain": "tazmo.co.jp",
    "founded": 1972,
    "same_as": [
      "https://www.wikidata.org/wiki/Q96313040"
    ],
    "employees": {
      "max": 1150,
      "min": 1150
    },
    "legal_name": "TAZMO Co., Ltd.",
    "description": "TAZMO Co., Ltd. develops, manufactures and sells semiconductor manufacturing equipment, clean transfer systems including wafer transfer robots, LCD/FPD manufacturing equipment, nanoimprint equipment, and precision molds and resin moldings."
  },
  "offerings": [
    {
      "id": "clean-transfer-equipment",
      "url": "https://tazmo.co.jp/products_en_cate/clean-en/",
      "kind": "hardware",
      "name": "Clean Transfer Equipment",
      "role": "manufacturer",
      "summary": "Atmospheric wafer transfer robots (ET-PLP, MTE, MTSR, TT301A series), pre-aligners (MAF-R, MAF-S series) and vacuum robots (MTP series) for semiconductor equipment and EFEMs.",
      "category": "wafer_handling_robot",
      "extensions": {
        "robotics": {
          "category": "wafer_handling_robot",
          "spec_version": "0.2"
        }
      }
    },
    {
      "id": "coater-developer",
      "url": "https://tazmo.co.jp/products_en_cate/semiconductor/csx-series",
      "kind": "hardware",
      "name": "Coater/Developer",
      "role": "manufacturer",
      "summary": "Automatic coater/developer systems (CSX and SPR series) for photolithography. The CSX series covers 150-300 mm wafers and square panels, with PI/PR thick-film processes of 10-100 µm.",
      "category": "semiconductor_equipment"
    },
    {
      "id": "bonder-debonder",
      "url": "https://tazmo.co.jp/products_en_cate/semiconductor/twh-series",
      "kind": "hardware",
      "name": "Bonder/Debonder",
      "role": "manufacturer",
      "summary": "Wafer bonding and debonding equipment (TWH and TWS series), including mechanical debonders, peel units, cleaners and bonders that separate carriers from device wafers.",
      "category": "semiconductor_equipment"
    },
    {
      "id": "cleaning-systems",
      "url": "https://tazmo.co.jp/products_en_cate/semiconductor/cenote",
      "kind": "hardware",
      "name": "Cleaning Systems",
      "role": "manufacturer",
      "summary": "Semiconductor wafer cleaning systems (CENOTE and VAP). CENOTE is a multi-cup single-wafer wet processor for 200 mm and 300 mm wafers, with acid, alkali and solvent chemical modules.",
      "category": "semiconductor_equipment"
    },
    {
      "id": "cmp-slurry-distribution-systems",
      "url": "https://tazmo.co.jp/products_en_cate/semiconductor/",
      "kind": "hardware",
      "name": "CMP Slurry Distribution Systems",
      "role": "manufacturer",
      "summary": "CMP slurry distribution systems for semiconductor fabs (iSIS1200J, New MX2000, and a powder oxidizer (APS) dissolute/distribution system).",
      "category": "semiconductor_equipment"
    },
    {
      "id": "fpd-manufacturing-equipment",
      "url": "https://tazmo.co.jp/products_en_cate/fpd-en/",
      "kind": "hardware",
      "name": "FPD Manufacturing Equipment",
      "role": "manufacturer",
      "summary": "FPD/PLP slit coaters (TZ series) and manual coaters (TMC series) for flat panel display and panel-level packaging substrates.",
      "category": "coating_equipment"
    },
    {
      "id": "nanoimprint",
      "url": "https://tazmo.co.jp/products/en-nanoimprint/",
      "kind": "hardware",
      "name": "Nanoimprint",
      "role": "manufacturer",
      "summary": "TIW series fully automated UV nanoimprint equipment for 200/300 mm wafers, with ±1 µm imprint accuracy, for optical devices such as AR/VR/MR optics and 3D sensors.",
      "category": "semiconductor_equipment"
    },
    {
      "id": "precision-molding-dies-and-plastic-moldings",
      "url": "https://tazmo.co.jp/en/products/precision-mold/",
      "kind": "service",
      "name": "Precision Molding Dies and Plastic Moldings",
      "role": "manufacturer",
      "summary": "Precision mold manufacturing, injection molding on 20-130 ton machines, emboss carrier tape (pneumatic, press and rotary molding), and precision parts for medical and biotechnology use.",
      "category": "contract_manufacturing"
    }
  ],
  "engagement": {
    "url": "https://tazmo.co.jp/en/contact/",
    "phone": "+81-86-239-5000"
  },
  "extensions": {
    "robotics": {
      "roles": [
        "robot_manufacturer"
      ],
      "spec_version": "0.2"
    }
  },
  "updated_at": "2026-09-28"
}