{
  "card_url": "https://itha.ai/c/tazmo.co.jp/card.json",
  "status": "unclaimed",
  "updated_at": "2026-09-28",
  "revision": 2,
  "provenance_url": "https://itha.ai/c/tazmo.co.jp/provenance.json",
  "card": {
    "itha": "0.2",
    "proof": {
      "certifications": [
        {
          "id": "iso_9001",
          "status": "self_declared",
          "evidence_url": "https://tazmo.co.jp/en/company/"
        },
        {
          "id": "iso_14001",
          "status": "self_declared",
          "evidence_url": "https://tazmo.co.jp/en/company/"
        }
      ]
    },
    "company": {
      "hq": {
        "city": "Okayama",
        "region": "Okayama",
        "country": "JP"
      },
      "url": "https://tazmo.co.jp/en/",
      "name": "TAZMO",
      "domain": "tazmo.co.jp",
      "founded": 1972,
      "same_as": [
        "https://www.wikidata.org/wiki/Q96313040"
      ],
      "employees": {
        "max": 1150,
        "min": 1150
      },
      "legal_name": "TAZMO Co., Ltd.",
      "description": "TAZMO Co., Ltd. develops, manufactures and sells semiconductor manufacturing equipment, clean transfer systems including wafer transfer robots, LCD/FPD manufacturing equipment, nanoimprint equipment, and precision molds and resin moldings."
    },
    "offerings": [
      {
        "id": "clean-transfer-equipment",
        "url": "https://tazmo.co.jp/products_en_cate/clean-en/",
        "kind": "hardware",
        "name": "Clean Transfer Equipment",
        "role": "manufacturer",
        "summary": "Atmospheric wafer transfer robots (ET-PLP, MTE, MTSR, TT301A series), pre-aligners (MAF-R, MAF-S series) and vacuum robots (MTP series) for semiconductor equipment and EFEMs.",
        "category": "wafer_handling_robot",
        "extensions": {
          "robotics": {
            "category": "wafer_handling_robot",
            "spec_version": "0.2"
          }
        }
      },
      {
        "id": "coater-developer",
        "url": "https://tazmo.co.jp/products_en_cate/semiconductor/csx-series",
        "kind": "hardware",
        "name": "Coater/Developer",
        "role": "manufacturer",
        "summary": "Automatic coater/developer systems (CSX and SPR series) for photolithography. The CSX series covers 150-300 mm wafers and square panels, with PI/PR thick-film processes of 10-100 µm.",
        "category": "semiconductor_equipment"
      },
      {
        "id": "bonder-debonder",
        "url": "https://tazmo.co.jp/products_en_cate/semiconductor/twh-series",
        "kind": "hardware",
        "name": "Bonder/Debonder",
        "role": "manufacturer",
        "summary": "Wafer bonding and debonding equipment (TWH and TWS series), including mechanical debonders, peel units, cleaners and bonders that separate carriers from device wafers.",
        "category": "semiconductor_equipment"
      },
      {
        "id": "cleaning-systems",
        "url": "https://tazmo.co.jp/products_en_cate/semiconductor/cenote",
        "kind": "hardware",
        "name": "Cleaning Systems",
        "role": "manufacturer",
        "summary": "Semiconductor wafer cleaning systems (CENOTE and VAP). CENOTE is a multi-cup single-wafer wet processor for 200 mm and 300 mm wafers, with acid, alkali and solvent chemical modules.",
        "category": "semiconductor_equipment"
      },
      {
        "id": "cmp-slurry-distribution-systems",
        "url": "https://tazmo.co.jp/products_en_cate/semiconductor/",
        "kind": "hardware",
        "name": "CMP Slurry Distribution Systems",
        "role": "manufacturer",
        "summary": "CMP slurry distribution systems for semiconductor fabs (iSIS1200J, New MX2000, and a powder oxidizer (APS) dissolute/distribution system).",
        "category": "semiconductor_equipment"
      },
      {
        "id": "fpd-manufacturing-equipment",
        "url": "https://tazmo.co.jp/products_en_cate/fpd-en/",
        "kind": "hardware",
        "name": "FPD Manufacturing Equipment",
        "role": "manufacturer",
        "summary": "FPD/PLP slit coaters (TZ series) and manual coaters (TMC series) for flat panel display and panel-level packaging substrates.",
        "category": "coating_equipment"
      },
      {
        "id": "nanoimprint",
        "url": "https://tazmo.co.jp/products/en-nanoimprint/",
        "kind": "hardware",
        "name": "Nanoimprint",
        "role": "manufacturer",
        "summary": "TIW series fully automated UV nanoimprint equipment for 200/300 mm wafers, with ±1 µm imprint accuracy, for optical devices such as AR/VR/MR optics and 3D sensors.",
        "category": "semiconductor_equipment"
      },
      {
        "id": "precision-molding-dies-and-plastic-moldings",
        "url": "https://tazmo.co.jp/en/products/precision-mold/",
        "kind": "service",
        "name": "Precision Molding Dies and Plastic Moldings",
        "role": "manufacturer",
        "summary": "Precision mold manufacturing, injection molding on 20-130 ton machines, emboss carrier tape (pneumatic, press and rotary molding), and precision parts for medical and biotechnology use.",
        "category": "contract_manufacturing"
      }
    ],
    "engagement": {
      "url": "https://tazmo.co.jp/en/contact/",
      "phone": "+81-86-239-5000"
    },
    "extensions": {
      "robotics": {
        "roles": [
          "robot_manufacturer"
        ],
        "spec_version": "0.2"
      }
    },
    "updated_at": "2026-09-28"
  }
}