{
  "icp": {
    "industries": [
      "Electronics manufacturing",
      "Semiconductor and advanced packaging"
    ]
  },
  "itha": "0.2",
  "proof": {
    "certifications": [
      {
        "id": "iso_9001",
        "status": "self_declared",
        "evidence_url": "https://www.tri.com.tw/en/about/about-1116-1-2.html"
      },
      {
        "id": "iso_14001",
        "status": "self_declared"
      },
      {
        "id": "iso_27001",
        "status": "self_declared"
      },
      {
        "id": "iso_45001",
        "status": "self_declared"
      },
      {
        "id": "semi_e187",
        "status": "self_declared"
      }
    ]
  },
  "company": {
    "hq": {
      "city": "Taipei",
      "country": "TW"
    },
    "url": "https://www.tri.com.tw/en/index.html",
    "name": "TRI",
    "domain": "tri.com.tw",
    "founded": 1989,
    "same_as": [
      "https://www.linkedin.com/company/tri-test-research-inc"
    ],
    "employees": {
      "min": 900
    },
    "legal_name": "Test Research, Inc.",
    "description": "Test Research, Inc. (TRI) manufactures test and inspection systems for PCB assembly and semiconductor manufacturing: solder paste, optical, conformal coating and X-ray inspection, manufacturing defects analyzers and in-circuit testers."
  },
  "offerings": [
    {
      "id": "3d-solder-paste-inspection",
      "url": "https://www.tri.com.tw/en/product/product-10-2.html",
      "kind": "hardware",
      "name": "3D Solder Paste Inspection (SPI)",
      "role": "manufacturer",
      "summary": "3D solder paste inspection systems (TR7007 series) for inspecting solder paste deposits on PCBs in SMT assembly lines.",
      "category": "inspection_system"
    },
    {
      "id": "automated-optical-inspection",
      "url": "https://www.tri.com.tw/en/product/product-11-2.html",
      "kind": "hardware",
      "name": "Automated Optical Inspection (AOI)",
      "role": "manufacturer",
      "summary": "Automated optical inspection systems (TR7500 and TR7700 series) for detecting assembly defects on populated PCBs.",
      "category": "inspection_system"
    },
    {
      "id": "conformal-coating-inspection",
      "url": "https://www.tri.com.tw/en/product/product-60-2.html",
      "kind": "hardware",
      "name": "Conformal Coating Inspection (CI AOI)",
      "role": "manufacturer",
      "summary": "Optical inspection systems with multi-phase lighting for UV-active conformal coatings; they measure coating thickness and inspect dispensed flux and glue.",
      "category": "inspection_system"
    },
    {
      "id": "automated-x-ray-inspection",
      "url": "https://www.tri.com.tw/en/product/product-12-2.html",
      "kind": "hardware",
      "name": "Automated X-ray Inspection (AXI)",
      "role": "manufacturer",
      "summary": "Automated X-ray inspection systems (TR7600 series) for inspecting solder joints on PCB assemblies.",
      "category": "inspection_system"
    },
    {
      "id": "manufacturing-defects-analyzer",
      "url": "https://www.tri.com.tw/en/product/product-13-2.html",
      "kind": "hardware",
      "name": "Manufacturing Defects Analyzer (MDA)",
      "role": "manufacturer",
      "summary": "Manufacturing defects analyzers (TR518 series, bench-top and inline) for electrical MDA testing of assembled boards.",
      "category": "test_equipment"
    },
    {
      "id": "in-circuit-tester",
      "url": "https://www.tri.com.tw/en/product/product-14-2.html",
      "kind": "hardware",
      "name": "In-Circuit Tester (ICT)",
      "role": "manufacturer",
      "summary": "In-circuit test systems (TR5001 and TR8100 series, bench-top and inline) for electrical testing of populated circuit boards.",
      "category": "test_equipment"
    },
    {
      "id": "semi-optical-inspection",
      "icp": {
        "industries": [
          "Semiconductor",
          "Advanced packaging"
        ]
      },
      "url": "https://www.tri.com.tw/en/product/product-85-2.html",
      "kind": "hardware",
      "name": "SEMI Optical Inspection",
      "role": "manufacturer",
      "summary": "Optical inspection and metrology systems for semiconductor back-end and advanced packaging: wafers, wire and die bonds, bumps and solder joints.",
      "category": "inspection_system"
    },
    {
      "id": "semi-x-ray-inspection",
      "icp": {
        "industries": [
          "Semiconductor",
          "Advanced packaging"
        ]
      },
      "url": "https://www.tri.com.tw/en/product/product-84-2.html",
      "kind": "hardware",
      "name": "SEMI X-Ray Inspection",
      "role": "manufacturer",
      "summary": "3D X-ray inspection systems with resolution down to 2 µm for semiconductor and advanced packaging inspection.",
      "category": "inspection_system"
    }
  ],
  "engagement": {
    "url": "https://www.tri.com.tw/en/contact/contact.html",
    "email": "sales@tri.com.tw",
    "phone": "+886 2 28328918"
  },
  "updated_at": "2026-09-27",
  "service_area": [
    "global"
  ]
}