ASSEMBLYLINE
Semiconductor assembly and packaging equipmentFully automated assembly systems for optoelectronics and singulated photonic devices and PICs.
ficonTEC builds automated micro-assembly and test systems for photonic and opto-electronic devices, including PICs and high-power laser diodes. Its installed base was over 1,000 systems as of Q1 2022.
Fully automated assembly systems for optoelectronics and singulated photonic devices and PICs.
Development and batch processing platform that combines µm/sub-µm optical alignment with multiple bonding technologies.
Fully automated mixed-signal electro-optical test systems for optoelectronics and singulated photonic devices.
Mixed-signal electro-optical test systems for non-singulated photonic integrated circuits (PICs) and other optoelectronic devices at wafer level.
Fully automated precision stacking and unstacking systems for semiconductor laser diode bars.
Laser microwelding machine cell in a 2- or 3-beam vertical configuration, using a fiber-coupled Nd:YAG laser.
Remote diagnostics, on-site field service, preventive maintenance, process optimization, spare parts, upgrades, refurbishment and PCM training for ficonTEC systems.