Hesse GmbH develops and manufactures fully automatic ultrasonic wire bonders, ultrasonic welding machines and laser welding systems for assembly and connection technology. It has subsidiaries in Hong Kong, the USA and Japan.
Fully automatic ultrasonic fine wire bonders (Bondjet BJ855–BJ885, BJ653) for wedge-wedge and ball-wedge bonding in HF/RF technology, COB, MCM, hybrids, optoelectronics and automotive electronics.
Ultrasonic heavy wire bonders (Bondjet BJ955, BJ959, BJ985, BJ931, BJ653, Lasersonic LSB959) for aluminum and copper wire or ribbon in automotive and power electronics.
Fully automatic ultrasonic welders for aluminum and copper connections, including battery cell contacting, power electronics terminals and pins, DCB assemblies and power/IGBT modules.
Laser welding systems (LW1089, LW2095) for fully and semi-automatic deep penetration welding of aluminum and copper leads on DCB substrates, in power electronics, battery cells and modules.
Customizable manufacturing cells combining Hesse wire bonders, ultrasonic and laser welding systems, transport and shuttle systems, cleaning and magazine loading/unloading.
Application-specific automation for Hesse bonding lines: transport systems, width-adjustable magazine lifts for magazines up to 18 kg, bonding stations, visualization and MES connectivity.
Pre-production prototyping, sample bonding and small-series production, plus online support, process support, training, consulting and cost-of-ownership analysis.