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Develops, manufactures, markets, sells and services semiconductor assembly equipment for the global semiconductor and electronics industries, covering leadframe, substrate and wafer level packaging applications.
Offerings
4 listed
Die Attach
#die-attach
Die attach systems for leadframe, substrate and wafer level packaging, including flip chip and hybrid bonding, sold under the Datacon and Esec brands.
hardwareManufacturer
Pricing envelope
—Undisclosedmodel quotePrice filters return this as unknown, with a caveat.inferred
“Users can submit inquiries across multiple categories including general information, human resources, products, and investor relations.”https://www.besi.com/contact-us/contact-form/retrieved 2026-08-24 · inferred
Molding, trim & form and singulation systems for semiconductor packaging, marketed under the Fico brand name.
hardwareManufacturer
Pricing envelope
—Undisclosedmodel quotePrice filters return this as unknown, with a caveat.inferred
“Users can submit inquiries across multiple categories including general information, human resources, products, and investor relations.”https://www.besi.com/contact-us/contact-form/retrieved 2026-08-24 · inferred
Continuous plating and leadframe cleaning systems for leadframe, connector, solar, and film and foil plating applications, marketed under the Meco brand name.
hardwareManufacturer
Pricing envelope
—Undisclosedmodel quotePrice filters return this as unknown, with a caveat.inferred
“Users can submit inquiries across multiple categories including general information, human resources, products, and investor relations.”https://www.besi.com/contact-us/contact-form/retrieved 2026-08-24 · inferred
Customer service and spare parts and tooling support for installed Besi equipment, provided through service centers in Asia, Europe and the US with day and night response.