COM-HPC Ecosystem
COM-HPC standard Computer-on-Modules (Mini, Client, Server form factors) supporting x86, ARM, GPUs, ASICs and FPGAs for high-bandwidth edge and embedded server applications.
Provider of high-performance hardware and software building blocks for embedded and edge computing solutions based on Computer-on-Modules (COMs), serving industrial automation, medical technology, robotics and telecommunications markets among others.
COM-HPC standard Computer-on-Modules (Mini, Client, Server form factors) supporting x86, ARM, GPUs, ASICs and FPGAs for high-bandwidth edge and embedded server applications.
COM Express standard Computer-on-Modules (Mini, Compact, Basic, Extended form factors) with Intel Core Ultra, Atom/Pentium/Celeron and AMD Ryzen Embedded processors, up to 128GB DDR5 memory.
SMARC 2.1 credit-card-sized Computer-on-Modules (82x50mm, up to 25W) with NXP i.MX, Intel Atom and TI processors, for size- and power-constrained AI edge applications.
Qseven mobile Computer-on-Modules (70x70mm or 40x70mm micro variant, up to 12W) with NXP i.MX and Intel Atom/Pentium/Celeron processors for rugged ultra-mobile embedded designs.
Single board computers including the Pico-ITX conga-PA7 based on Intel Atom x6000E, Pentium and Celeron J processors, for edge applications requiring industrial reliability and low power.
aReady application-ready building blocks combining Computer-on-Modules (aReady.COM), virtualization (aReady.VT), IoT connectivity (aReady.IOT) and a certified system integration service.