Supplies automated microelectronic assembly machines and contract assembly services specializing in precision die attach, wire bonding and vacuum reflow solutions for the semiconductor and photonics industries.
Automated die attach systems for microelectronic and photonic device packaging, supporting epoxy, UV, solder paste, eutectic, silver sintering, and thermocompression die attach processes.
Automated wire and wedge bonding equipment for microelectronic device packaging.
Automated vacuum pressure soldering and reflow furnaces for flux-less die attach and power module assembly, heating up to 500°C under vacuum.
High vacuum furnaces for hermetic sealing of MEMS, infrared sensor, and wafer-level packages, reaching vacuum levels as low as 10-7 Torr and temperatures up to 500°C (1000°C optional).
Contract manufacturing and outsourced semiconductor assembly and test services, including process development, package prototyping, and production for die attach, wire bonding, and vacuum reflow.