Test Research, Inc. (TRI) manufactures test and inspection systems for PCB assembly and semiconductor manufacturing: solder paste, optical, conformal coating and X-ray inspection, manufacturing defects analyzers and in-circuit testers.
3D solder paste inspection systems (TR7007 series) for inspecting solder paste deposits on PCBs in SMT assembly lines.
Automated optical inspection systems (TR7500 and TR7700 series) for detecting assembly defects on populated PCBs.
Optical inspection systems with multi-phase lighting for UV-active conformal coatings; they measure coating thickness and inspect dispensed flux and glue.
Automated X-ray inspection systems (TR7600 series) for inspecting solder joints on PCB assemblies.
Manufacturing defects analyzers (TR518 series, bench-top and inline) for electrical MDA testing of assembled boards.
In-circuit test systems (TR5001 and TR8100 series, bench-top and inline) for electrical testing of populated circuit boards.
Optical inspection and metrology systems for semiconductor back-end and advanced packaging: wafers, wire and die bonds, bumps and solder joints.
3D X-ray inspection systems with resolution down to 2 µm for semiconductor and advanced packaging inspection.