Hesse Mechatronics
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#fine-wire-bonderSemiconductor assembly and packaging equipment
Fine Wire Bonder (Bondjet)
Fully automatic ultrasonic fine wire bonders (Bondjet BJ855–BJ885, BJ653) for wedge-wedge and ball-wedge bonding in HF/RF technology, COB, MCM, hybrids, optoelectronics and automotive electronics.
✓ SEMI S2 · self-declared✓ category = semiconductor_assembly✓ serves europe
#heavy-wire-bonderSemiconductor assembly and packaging equipment
Heavy Wire Bonder (Bondjet)
Ultrasonic heavy wire bonders (Bondjet BJ955, BJ959, BJ985, BJ931, BJ653, Lasersonic LSB959) for aluminum and copper wire or ribbon in automotive and power electronics.
✓ SEMI S2 · self-declared✓ category = semiconductor_assembly✓ serves europe