A global supplier of hardware and software solutions for the manufacture of semiconductors and electronics, operating through Semiconductor Solutions, SMT Solutions, and Critical Manufacturing (MES software) segments.
Advanced-packaging equipment for semiconductor manufacturing: laser dicing/grooving, fan-out bonding, thermo-compression bonding, hybrid bonding, and ultra-high-precision die bonding.
Back-end assembly equipment for IC and discrete semiconductor devices, spanning die bonding, wire bonding, silver sintering, encapsulation, and singulation/trim/form processes.
Packaging equipment for CMOS image sensor modules, covering die bonding, wire bonding, cleaning, AOI, lens attachment, and active alignment for consumer and automotive imaging applications.
SIPLACE surface-mount placement platforms including SIPLACE V, SX, TX, X S, and the CA2 hybrid die/SMT placement system, spanning small-batch to high-volume production.
DEK stencil printing systems (TQ, NeoHorizon, Galaxy) for solder paste application in SMT production, with stencil cleaning, printhead paste-height control, and automatic dispensing.
Process Lens solder paste inspection systems using Moire phase shift technology for shadow-free 2D/3D measurement, integrable with WORKS Optimization for self-learning inline process control.
Modular shop-floor automation software comprising Planning, Logistics, Preparation, Operations, Monitoring, Optimization, Integration, and Programming applications for SMT production lines.
MES software for semiconductor, electronics, medical device, and industrial equipment manufacturers, with execution, automation, analytics, digital twin, and AI copilot features.