HANMI Semiconductor manufactures semiconductor assembly and packaging equipment, including thermal-compression bonders, flip-chip bonders, vision placement systems, micro saw equipment, EMI shield equipment, grinders and laser systems for semiconductor back-end processing.
Thermal-compression bonding equipment for stacking high bandwidth memory (HBM) dies, including Dual TC Bonder Dragon, Griffin and Tiger models and a dedicated HBM 6-side inspection system.
Thermal-compression and flip-chip bonding systems for semiconductor die and package assembly, spanning the 3.0 to 8.0 model series and multi-die and big-die variants.
Vision-guided die/package placement systems in the 6.0 and 8.0 series, including Griffin, D, L, T Fast, UD, UL and PS model variants used in semiconductor package assembly.
Sawing equipment for cutting semiconductor packages, offered in eight models (W1121α, T2101, T1121, P2101, PL1121, PL1201, PL1241, GL2101).
Equipment for applying and removing EMI shielding on semiconductor packages, including the EMI Shield Vision Attach 2.0 Dragon and related tape-handling systems.
Grinding equipment for semiconductor package processing.
Laser ablation and laser marking equipment for semiconductor package processing.