3D-SPI
Machine vision system3D solder paste inspection system for SMT solder-printing inspection, measuring paste area, height, and volume and detecting bridges, spikes, and BGA coplanarity defects.
SAKI manufactures automated optical and X-ray inspection equipment for printed circuit board assemblies, semiconductor packages, and power modules, replacing manual visual inspection with automated imaging analysis.
3D solder paste inspection system for SMT solder-printing inspection, measuring paste area, height, and volume and detecting bridges, spikes, and BGA coplanarity defects.
3D automated optical inspection system for SMT and through-hole assembly, covering high-density boards, small components, and mixed tall-component boards.
Inline 3D X-ray automated inspection system using proprietary planar-CT imaging for SMT and through-hole solder joint inspection, including BGA head-in-pillow/void detection and bridge defects.
2D bottom-side optical inspection system (model 2Di-LU1) that verifies through-hole solder quality after selective, flow, or dip soldering without requiring board flipping.
3D-CT X-ray inspection system for IGBT and DSC power modules, using planar-CT imaging to separate solder layers and detect voids, with noise cancellation for heat-fin artifacts.