TAZMO Co., Ltd. develops, manufactures and sells semiconductor manufacturing equipment, clean transfer systems including wafer transfer robots, LCD/FPD manufacturing equipment, nanoimprint equipment, and precision molds and resin moldings.
Atmospheric wafer transfer robots (ET-PLP, MTE, MTSR, TT301A series), pre-aligners (MAF-R, MAF-S series) and vacuum robots (MTP series) for semiconductor equipment and EFEMs.
Automatic coater/developer systems (CSX and SPR series) for photolithography. The CSX series covers 150-300 mm wafers and square panels, with PI/PR thick-film processes of 10-100 µm.
Wafer bonding and debonding equipment (TWH and TWS series), including mechanical debonders, peel units, cleaners and bonders that separate carriers from device wafers.
Semiconductor wafer cleaning systems (CENOTE and VAP). CENOTE is a multi-cup single-wafer wet processor for 200 mm and 300 mm wafers, with acid, alkali and solvent chemical modules.
CMP slurry distribution systems for semiconductor fabs (iSIS1200J, New MX2000, and a powder oxidizer (APS) dissolute/distribution system).
FPD/PLP slit coaters (TZ series) and manual coaters (TMC series) for flat panel display and panel-level packaging substrates.
TIW series fully automated UV nanoimprint equipment for 200/300 mm wafers, with ±1 µm imprint accuracy, for optical devices such as AR/VR/MR optics and 3D sensors.
Precision mold manufacturing, injection molding on 20-130 ton machines, emboss carrier tape (pneumatic, press and rotary molding), and precision parts for medical and biotechnology use.