Hesse Mechatronics
hesse-mechatronics.com#fine-wire-bonderSemiconductor assembly and packaging equipment
Fine Wire Bonder (Bondjet)Fully automatic ultrasonic fine wire bonders (Bondjet BJ855–BJ885, BJ653) for wedge-wedge and ball-wedge bonding in HF/RF technology, COB, MCM, hybrids, optoelectronics and automotive electronics.
✓ SEMI S2 · self-declared✓ category = semiconductor_equipment✓ serves europe
#heavy-wire-bonderSemiconductor assembly and packaging equipment
Heavy Wire Bonder (Bondjet)Ultrasonic heavy wire bonders (Bondjet BJ955, BJ959, BJ985, BJ931, BJ653, Lasersonic LSB959) for aluminum and copper wire or ribbon in automotive and power electronics.
✓ SEMI S2 · self-declared✓ category = semiconductor_equipment✓ serves europe
Hine Automation
hineautomation.com#vacuum-robotic-armsWafer and substrate handling robot
Vacuum Robotic ArmsVacuum wafer-handling robot arms (HA-3.2, HA-5.0) for wafers up to 300 mm, used as the central handling robot in Constellation Systems. Payload is 2.5 kg standard or 4.5 kg high-load.
✓ SEMI S2 · self-declared✓ category = semiconductor_equipment✓ serves europe
#vacuum-transfer-systems-integratedSemiconductor manufacturing equipment
Vacuum Transfer Systems (Integrated)Constellation Systems: cassette-to-cassette integrated wafer handling systems for wafers up to 200 mm. Base operating pressure is below 5 x 10^-7 Torr.
✓ SEMI S2 · self-declared✓ category = semiconductor_equipment✓ serves europe
#vacuum-elevatorsSemiconductor manufacturing equipment
Vacuum ElevatorsVacuum random access elevators (HA-50V, HA-51V) for substrate indexing in high vacuum, with payload up to 34 kg and Z-axis repeatability of ±0.05 mm.
✓ SEMI S2 · self-declared✓ category = semiconductor_equipment✓ serves europe