Solder paste inspection (SPI) systems Process Lens and Process Lens HD, using Moiré phase-shift combined 2D/3D measurement, with IPC-HERMES-9852 and IPC-2591 CFX interfaces.
Automated visual inspection systems with a greyscale camera, lighting and OwlVision software that detect surface and edge defects. VI-X is a robotic cell; SI-X is an adaptable kit.
IML vision inspection using the Intravis IMLWatcher, a camera system that detects IML-specific defects such as label position, print errors, flash and contamination.
Machine-vision inspection and metrology systems, including in-process wafer inspection, 2D/3D wafer metrology and white light interferometry optical profiling.
Automatic inspection machines: the VP Series solder paste inspection machine for electronic circuit boards and the IS-UVCL01 transparent object inspection system.
Robotized ECA/PAUT inspection system. A custom Eddyfi probe sits on the robot's end effector, and an Ectane 3 or Panther 2 instrument controls the system.
Instruments for carcass grading, sorting, yield management, tracking and quality control, including automatic carcass identification and livestock evaluation management systems.
Package testing and contaminant detection equipment: checkweighers, seal checkers and X-ray (Ishida), and metal detection for food and pharmaceutical products (CEIA).
IX Series X-ray inspection systems that detect foreign bodies in food products, including poultry, sausages, loose products, sealed packs and tall vertical containers.
DACS series checkweighers that check product weight in-line. Models cover multilane lines, cartons, large products, individually wrapped products and small products.
Stand-alone metal detection systems (cosmo-one, IND Series, cylindrical) offered in Japan and surrounding territories. Integrated metal detectors are an option on Ishida checkweighers.
Robot-guided inspection system that detects and classifies paint defects on car bodies down to 0.15 mm. It inspects a full car body in 50–70 seconds on stop-and-go or moving lines.
Bead inspection systems (RTVision, RTVision.3d, RTVision.t) for adhesive and sealant beads in vehicle body, paint shop and EV battery production.
Surface inspection system that detects and classifies defects on steel, aluminum and copper surfaces, with 2D matrix, 2D line and 3D laser sensor options.
Inline inspection system that detects and classifies surface defects at every process stage of web materials such as film, nonwovens and composites. More than 4,000 installations worldwide.
Inspection and measurement systems for float glass production, covering distortion, thickness and width, coating colour and stress measurement.
RV series machines for 3D solder paste inspection and board visual inspection (AOI) that detect defects on printed circuit boards.
3D solder paste inspection systems for SMT assembly lines that measure solder paste volume. Models: aSPIre 3, KY8030-3, KY8030-2, KY8080.
Zenith series 3D automated optical inspection systems that measure the shapes of components, solder joints and patterns on assembled PCBs, with IPC-based solder joint inspection.
3D inspection systems for advanced packaging and Mini-LED applications. Models: Meister S, Meister D/D+, ZenStar, Prime.
Neptune C+ inspects conformal coating, underfill, epoxy, bonding and glue using low-coherence interferometry (L.I.F.T), with 2D, 3D and cross-section views.
3D inspection systems for back-end pin insertion, machining and final assembly, covering mixed SMDs and pins. Models: KY-P3, Infy.
Machines that inspect glass and plastic containers holding liquid, freeze-dried or powdered products, part of the aseptic range.
Inspection systems for banknotes, passport pages, coins and printed cylindrical containers that check substrate, print, surface and security features under white, UV and infrared light.
Checkweighers, visual inspection systems, X-ray systems for foreign object detection and metal detectors for integration into packaging processes.
Inspection camera equipment for pipes, drains, tanks and confined spaces: borescopes and videoscopes, push rod cameras, tank and vessel cameras, drones and Ex-rated equipment.
Dimensioning, weighing and scanning solution combining imaging, scanning, volume measurement and weighing for logistics parcel handling.
3D solder paste inspection systems for the SMT solder printing process, measuring solder paste area, height, volume, bridge and solder horn. Models: 3Si-MS3EX, 3Si-LS3EX, 3Si-ZS3EX.
3D automated optical inspection systems for SMT and through-hole processes on printed circuit board assemblies. Models: 3Di-MS3EX, 3Di-LS3EX, 3Di-ZS3EX.
Inline 3D-CT automated X-ray inspection systems for SMT, through-hole and semiconductor inspection processes. Models: 3Xi-M110, 3Xi-M110 V3, 3Xi-M110 V4.
Automated X-ray inspection system for large-format (XXL) PCBs up to 1,000 x 690 mm. Model: 3Xi-ZS1EX.
3D-CT X-ray inspection system for power modules with multi-layered solder, including detection of voids in three-layer soldering. Model: 3Xi-M200.
2D bottom-side inspection machine that checks solder quality of through-hole components after selective, flow and dip soldering. Model: 2Di-LU1.
Automated 3D laser measurement systems that combine SCANOLOGY 3D scanners or trackers with collaborative robots and turntables for automated measurement.
Pressure decay and light leak testers for round, square and irregular cans, pails and drums.
Automatic quality control systems and instruments that detect defects on ceramic tiles and slabs, including Qualitron, Eye-Tron, Creavision e-View and Planar.
3D solder paste inspection systems (TR7007 series) for inspecting solder paste deposits on PCBs in SMT assembly lines.
Automated optical inspection systems (TR7500 and TR7700 series) for detecting assembly defects on populated PCBs.
Optical inspection systems with multi-phase lighting for UV-active conformal coatings; they measure coating thickness and inspect dispensed flux and glue.
Automated X-ray inspection systems (TR7600 series) for inspecting solder joints on PCB assemblies.
Optical inspection and metrology systems for semiconductor back-end and advanced packaging: wafers, wire and die bonds, bumps and solder joints.
3D X-ray inspection systems with resolution down to 2 µm for semiconductor and advanced packaging inspection.
MISTOL inspection and sorting equipment for parts. Intended to replace manual inspection.
Machine vision inspection systems for production lines.
Vision inspection systems for quality control of form, fill and labelling, ranging from smart sensors and smart cameras to line-scan, telecentric-lens and PC-based vision systems.