#advanced-packagingSemiconductor assembly and packaging equipment
Advanced PackagingSemiconductor advanced packaging equipment covering laser dicing and grooving, fan-out bonding, thermo-compression bonding, hybrid bonding and ultra high precision die bonding (AMICRA series).
✓ category = semiconductor_assembly✓ serves DE
#ic-discreteSemiconductor assembly and packaging equipment
IC & DiscreteSemiconductor back-end equipment for IC and discrete devices: die attach, silver sintering, wire bonding, encapsulation, and singulation, trim & form.
✓ category = semiconductor_assembly✓ serves DE
#cmos-image-sensorSemiconductor assembly and packaging equipment
CMOS Image SensorEquipment for CMOS image sensor packaging covering die bonding, wire bonding, cleaning, AOI, lens attachment and active alignment.
✓ category = semiconductor_assembly✓ serves DE
#hybrid-bondingSemiconductor assembly and packaging equipment
Hybrid BondingDatacon hybrid bonding systems for die attach in advanced packaging and 3D integration.
✓ category = semiconductor_assembly✓ serves DE
#thermo-compression-bondingSemiconductor assembly and packaging equipment
Thermo Compression BondingThermo compression bonding (TCB) systems for advanced packaging applications.
✓ category = semiconductor_assembly✓ serves DE
#multi-module-attachSemiconductor assembly and packaging equipment
Multi Module AttachDatacon 2200 evo series systems for die attach, multi-chip and flip chip applications.
✓ category = semiconductor_assembly✓ serves DE
#die-bondingSemiconductor assembly and packaging equipment
Die BondingEsec 2100 series die attach systems for semiconductor assembly.
✓ category = semiconductor_assembly✓ serves DE
#soft-solder-die-bondingSemiconductor assembly and packaging equipment
Soft Solder Die BondingFully automated Esec soft solder die attach equipment for power semiconductor mass production.
✓ category = semiconductor_assembly✓ serves DE
#flip-chipSemiconductor assembly and packaging equipment
Flip ChipDatacon and Esec flip chip systems for mass production and high-end applications, covering a range of flip chip processes.
✓ category = semiconductor_assembly✓ serves DE
#moldingSemiconductor assembly and packaging equipment
MoldingFico automatic and manual molding systems for semiconductor packaging.
✓ category = semiconductor_assembly✓ serves DE
#trim-formSemiconductor assembly and packaging equipment
Trim & FormFico trim and form systems that cut and form semiconductor package leads.
✓ category = semiconductor_assembly✓ serves DE
#singulationSemiconductor assembly and packaging equipment
SingulationFico singulation machines for high volume semiconductor package separation.
✓ category = semiconductor_assembly✓ serves DE
#assemblylineSemiconductor assembly and packaging equipment
ASSEMBLYLINEFully automated assembly systems for optoelectronics and singulated photonic devices and PICs.
✓ category = semiconductor_assembly✓ serves DE
#customlineSemiconductor assembly and packaging equipment
CUSTOMLINEDevelopment and batch processing platform that combines µm/sub-µm optical alignment with multiple bonding technologies.
✓ category = semiconductor_assembly✓ serves DE
#stacklineSemiconductor assembly and packaging equipment
STACKLINEFully automated precision stacking and unstacking systems for semiconductor laser diode bars.
✓ category = semiconductor_assembly✓ serves DE
HANMI Semiconductor
hanmisemi.com#hbm-tc-bonderSemiconductor assembly and packaging equipment
HBM TC BONDERThermo-compression (TC) bonder family for HBM production. Models listed: TC BONDER 4.5 GRIFFIN, 4.0 TIGER, 1.0 GRIFFIN, 1.0 TIGER; the family also lists HBM 6-SIDE INSPECTION 1.0.
✓ category = semiconductor_assembly✓ serves DE
#2-5d-tc-bonderSemiconductor assembly and packaging equipment
2.5D TC BONDER2.5D thermo-compression bonder family. Models listed: 2.5D TC BONDER 120, 2.5D TC BONDER 40 C2S, 2.5D TC BONDER 40 C2W, BOC COB BONDER.
✓ category = semiconductor_assembly✓ serves DE
#fc-bonderSemiconductor assembly and packaging equipment
FC BONDERFC BONDER equipment family. Models listed: FC BONDER 3.0, FC BONDER 3.5, FC BONDER 5.0, FC BONDER 75.
✓ category = semiconductor_assembly✓ serves DE
#vision-placementSemiconductor assembly and packaging equipment
VISION PLACEMENTVISION PLACEMENT equipment family, first developed by HANMI in 1998. Models listed: 6.0 GRIFFIN, 6.0D, 6.0L, 6.0T FAST, 8.0PS, 8.0UD, 8.0UL.
✓ category = semiconductor_assembly✓ serves DE
#micro-sawSemiconductor assembly and packaging equipment
micro SAWSemiconductor package cutting equipment family, launched in 2021. Eight models listed, including micro SAW W1121α, T2101, T1121, P2101 and GL2101.
✓ category = semiconductor_assembly✓ serves DE
#emi-shieldSemiconductor assembly and packaging equipment
EMI SHIELDEMI SHIELD equipment family listed in HANMI's equipment line-up; five models listed.
✓ category = semiconductor_assembly✓ serves DE
#meta-grinderSemiconductor assembly and packaging equipment
META GRINDERGrinding equipment family listed in HANMI's equipment line-up. Model listed: META GRINDER 1.0.
✓ category = semiconductor_assembly✓ serves DE
#laserSemiconductor assembly and packaging equipment
LASERLaser equipment family. Models listed: LASER ABLATION 5.0, LASER MARK 3000S.
✓ category = semiconductor_assembly✓ serves DE
Hesse Mechatronics
hesse-mechatronics.com#fine-wire-bonderSemiconductor assembly and packaging equipment
Fine Wire Bonder (Bondjet)Fully automatic ultrasonic fine wire bonders (Bondjet BJ855–BJ885, BJ653) for wedge-wedge and ball-wedge bonding in HF/RF technology, COB, MCM, hybrids, optoelectronics and automotive electronics.
✓ category = semiconductor_assembly✓ serves DE
#heavy-wire-bonderSemiconductor assembly and packaging equipment
Heavy Wire Bonder (Bondjet)Ultrasonic heavy wire bonders (Bondjet BJ955, BJ959, BJ985, BJ931, BJ653, Lasersonic LSB959) for aluminum and copper wire or ribbon in automotive and power electronics.
✓ category = semiconductor_assembly✓ serves DE
#semiconductor-aiSemiconductor assembly and packaging equipment
Semiconductor & AI (Die Sorting and Carrier Tape Technologies)Die sorting systems that handle wafer, tape & reel, tray and panel formats with 6-side inspection, and carrier tape systems that link sorting to final packaging.
✓ category = semiconductor_assembly✓ serves DE
#die-bonding-solutionsSemiconductor assembly and packaging equipment
Die Bonding SolutionsMRSI eutectic and epoxy die bonding systems, active alignment systems and epoxy dispensers for photonic and semiconductor applications, from R&D and NPI to high-volume manufacturing.
✓ category = semiconductor_assembly✓ serves DE
#photonic-interconnectsSemiconductor assembly and packaging equipment
Photonic InterconnectsVanguard Automation 3D nano-printing machines, materials and software for photonic wire bonding and facet-attached micro-optics between optical components.
✓ category = semiconductor_assembly✓ serves DE
Shibuya Corporation
shibuya.co.jp#solder-ball-mountersSemiconductor assembly and packaging equipment
Solder Ball MountersEquipment that places solder balls for high-density semiconductor packaging.
✓ category = semiconductor_assembly✓ serves DE
#ball-bonderSemiconductor assembly and packaging equipment
Ball BonderBall bonding equipment for semiconductor wire bonding applications, with automation and Industry 4.0 integration.
✓ category = semiconductor_assemblyserves unknown · included
#wedge-bonderSemiconductor assembly and packaging equipment
Wedge BonderWire and ribbon wedge bonding equipment for power semiconductors, automotive power modules and industrial power hybrids.
✓ category = semiconductor_assemblyserves unknown · included
#advanced-packagingSemiconductor assembly and packaging equipment
Advanced PackagingThermo-compression bonding equipment for fluxless advanced packaging processes and heterogeneous integration.
✓ category = semiconductor_assemblyserves unknown · included
#wafer-level-bonderSemiconductor assembly and packaging equipment
Wafer Level BonderWafer-level bonders for advanced wafer-level packaging, supporting wire bonding and vertical applications.
✓ category = semiconductor_assemblyserves unknown · included
#advanced-power-assemblySemiconductor assembly and packaging equipment
Advanced Power AssemblyAssembly equipment for high-power devices, including wide bandgap materials, used in automotive, renewable energy and electronics manufacturing.
✓ category = semiconductor_assemblyserves unknown · included
#capillariesSemiconductor assembly and packaging equipment
CapillariesBonding tools (capillaries) for semiconductor packaging, supplied in standard designs and customized versions.
✓ category = semiconductor_assemblyserves unknown · included
Palomar Technologies
palomartechnologies.com#die-bondersSemiconductor assembly and packaging equipment
Die BondersAutomated die bonders for precision die attach in microelectronic assembly. The family comprises the 3880-II, 6532HP and 6500 models.
✓ category = semiconductor_assemblyserves unknown · included
#wire-wedge-bondersSemiconductor assembly and packaging equipment
Wire & Wedge BondersAutomated wire bonders for microelectronic assembly. The family comprises the 9000 Wedge Bonder and the 8100 Wire/Ball Bonder.
✓ category = semiconductor_assemblyserves unknown · included
#sst-vacuum-reflow-systemsSemiconductor assembly and packaging equipment
SST Vacuum Reflow SystemsSST vacuum pressure soldering systems and furnaces for vacuum reflow. The family comprises the 8300 Series, 5100, 3130, 518 and the 1200 Table Top Furnace.
✓ category = semiconductor_assemblyserves unknown · included
#sst-high-vacuum-furnacesSemiconductor assembly and packaging equipment
SST High Vacuum FurnacesSST high vacuum furnaces. The family comprises the 3150 High Vacuum Furnace and the 3250 High Vacuum Wafer Furnace.
✓ category = semiconductor_assemblyserves unknown · included