43 companies · 111 offerings

Semiconductor advanced packaging equipment covering laser dicing and grooving, fan-out bonding, thermo-compression bonding, hybrid bonding and ultra high precision die bonding (AMICRA series).

Semiconductor back-end equipment for IC and discrete devices: die attach, silver sintering, wire bonding, encapsulation, and singulation, trim & form.

Equipment for CMOS image sensor packaging covering die bonding, wire bonding, cleaning, AOI, lens attachment and active alignment.

Datacon hybrid bonding systems for die attach in advanced packaging and 3D integration.

Thermo compression bonding (TCB) systems for advanced packaging applications.

Datacon 2200 evo series systems for die attach, multi-chip and flip chip applications.

Esec 2100 series die attach systems for semiconductor assembly.

Fully automated Esec soft solder die attach equipment for power semiconductor mass production.

Datacon and Esec flip chip systems for mass production and high-end applications, covering a range of flip chip processes.

Fico automatic and manual molding systems for semiconductor packaging.

Fico trim and form systems that cut and form semiconductor package leads.

Fico singulation machines for high volume semiconductor package separation.

Steppers, scanners and nanoimprint lithography equipment that transfer circuit patterns from a mask to a wafer or panel. The lineup includes KrF and i-line models.

Fully automated assembly systems for optoelectronics and singulated photonic devices and PICs.

Development and batch processing platform that combines µm/sub-µm optical alignment with multiple bonding technologies.

Fully automated precision stacking and unstacking systems for semiconductor laser diode bars.

Thermo-compression (TC) bonder family for HBM production. Models listed: TC BONDER 4.5 GRIFFIN, 4.0 TIGER, 1.0 GRIFFIN, 1.0 TIGER; the family also lists HBM 6-SIDE INSPECTION 1.0.

2.5D thermo-compression bonder family. Models listed: 2.5D TC BONDER 120, 2.5D TC BONDER 40 C2S, 2.5D TC BONDER 40 C2W, BOC COB BONDER.

FC BONDER equipment family. Models listed: FC BONDER 3.0, FC BONDER 3.5, FC BONDER 5.0, FC BONDER 75.

VISION PLACEMENT equipment family, first developed by HANMI in 1998. Models listed: 6.0 GRIFFIN, 6.0D, 6.0L, 6.0T FAST, 8.0PS, 8.0UD, 8.0UL.

Semiconductor package cutting equipment family, launched in 2021. Eight models listed, including micro SAW W1121α, T2101, T1121, P2101 and GL2101.

EMI SHIELD equipment family listed in HANMI's equipment line-up; five models listed.

Grinding equipment family listed in HANMI's equipment line-up. Model listed: META GRINDER 1.0.

Laser equipment family. Models listed: LASER ABLATION 5.0, LASER MARK 3000S.

Fully automatic ultrasonic fine wire bonders (Bondjet BJ855–BJ885, BJ653) for wedge-wedge and ball-wedge bonding in HF/RF technology, COB, MCM, hybrids, optoelectronics and automotive electronics.

Ultrasonic heavy wire bonders (Bondjet BJ955, BJ959, BJ985, BJ931, BJ653, Lasersonic LSB959) for aluminum and copper wire or ribbon in automotive and power electronics.

SCARA-type substrate handling robots for atmospheric front ends, with integrated controller and 3-axis motion. Models Hatm-4.0 and Hatm-5.0 carry payloads up to 0.5 kg.

Vacuum wafer-handling robot arms (HA-3.2, HA-5.0) for wafers up to 300 mm, used as the central handling robot in Constellation Systems. Payload is 2.5 kg standard or 4.5 kg high-load.

Equipment front end modules (DLP-300) that transport silicon wafers or quartz photomasks between storage carriers and processing, measurement and test systems. Throughput is above 60 wafers per hour.

Constellation Systems: cassette-to-cassette integrated wafer handling systems for wafers up to 200 mm. Base operating pressure is below 5 x 10^-7 Torr.

Star Systems automated load locks (SL-200, SL-300, SL-450) for single-substrate vacuum transfer into OEM process chambers. Applications include ALD, PVD, CVD, etch and MEMS.

Vacuum random access elevators (HA-50V, HA-51V) for substrate indexing in high vacuum, with payload up to 34 kg and Z-axis repeatability of ±0.05 mm.

Atmospheric random access elevators (HAtm-50) for substrate indexing, with payload up to 34 kg and vertical strokes of 185 mm and 305 mm.

Die sorting systems that handle wafer, tape & reel, tray and panel formats with 6-side inspection, and carrier tape systems that link sorting to final packaging.

Mask writers and mask metrology systems for photomask production for the display and semiconductor industries.

MRSI eutectic and epoxy die bonding systems, active alignment systems and epoxy dispensers for photonic and semiconductor applications, from R&D and NPI to high-volume manufacturing.

Vanguard Automation 3D nano-printing machines, materials and software for photonic wire bonding and facet-attached micro-optics between optical components.

Mini-Max EFEM minienvironment systems, SortMax+ wafer sorters and CODEX substrate stockers, including customized EFEM and stocker equipment.

Atmospheric and vacuum wafer handling robots, load ports and prealigners for wafer sizes up to 300 mm and flat panel displays.

Customised test equipment (turret, gravity feed, linear pick-and-place), back-end vision inspection equipment, and laser marking, cutting and deburring systems for discrete and IC devices.

Turnkey equipment for electro-optical and MEMS sensors covering active alignment assembly, wafer-level and module-level test, and burn-in.

Equipment for silicon carbide, gallium nitride and power module manufacturing: automated assembly, automated optical inspection, burn-in, and wafer- to module-level test.

Burn-in, test, inspection and sorting equipment for advanced packaging at wafer, die, panel and system level, including the ZANX, LUMON, SINAR, AERO-20, BAYAN, PINTAR and MASON series.

Direct drive vacuum robots for wafer and panel handling in semiconductor, power electronics, LED, FPD and packaging equipment, in dual, quad, side-by-side and single SCARA configurations.

Equipment that places solder balls for high-density semiconductor packaging.

Illumination systems and six-mirror projection optics for EUV lithography at a wavelength of 13.5 nm, used in microchip production.

Photomask metrology, tuning, qualification and repair solutions for DUV and EUV mask types, from ZEISS Semiconductor Mask Solutions (SMS).

Wafer transfer robot series for 2- to 12-inch wafers, atmospheric and vacuum models, for heat treatment, cleaning, etching, thin film, lithography, thinning, bonding.

Vacuum substrate-transfer robots for semiconductor vacuum processing, including MagnaTran high-temperature robots and Leap vacuum robot platforms.

Marathon vacuum systems, EFEM platforms, transport systems and sorter systems for handling wafer, panel and film-based substrates in semiconductor fabs and advanced packaging.

Load ports, EUV reticle load ports, SMIF and Versaport interfaces, and Auto ID systems for semiconductor tools. Install base of more than 10,000 300 mm load ports.

PuroMaxx carrier cleaning systems, PuroVision, PuroMetric and PuroSense inspection and metrology, and PuroView FOUP fleet management software for wafer carrier contamination control.

GuardianPro reticle storage systems and PuroMaxx 2 automated reticle handling for lithography operations. More than 1,000 systems deployed.

Automated material handling systems (AMHS) for semiconductor and flat panel display cleanrooms: overhead hoist transport, nitrogen purge storage, and Gen 4 to Gen 10 glass substrate handling.

ACTRANS wafer transfer robots for vacuum and atmospheric environments, handling wafers up to 300 mm; the line also includes wafer aligners and FPD transfer robots.

RF/MW power generators and automatic-tuning match units for plasma processes in semiconductor manufacturing, with functions including pulsed RF output.

Single and batch wafer cleaning equipment for semiconductor front-end (clean, etch, strip) and post-process (flux, etch, debond) steps; models include ION12, APOLLON, VENUS, BW Series, ATOM.

Rapid thermal processing (RTP) system for leading-edge memory and logic device processes.

Wafer handling robot for vacuum environments, listed in the ATM Robot (Display) line.

Plasma process monitors for etching, sputtering and CVD, Stealth Dicing laser dicing, micro LED PL inspection systems and semiconductor failure analysis systems.

Robots for handling within flat panel display (FPD) processes and for transferring materials between process stages.

Equipment Front End Module and sorter placed in front of wafer and panel process equipment, offered in 300 mm configurations with 4-port, 2x2-port and 2-port options.

Atmospheric and vacuum wafer transfer robots for 300 mm wafers in low- and high-vacuum environments, plus robots for FOPLP.

FOUP openers (300 mm KWF series and FOPLP variants) and 200 mm SMIF pod openers (KWO, KWY and KWP series).

Wafer transfer robots for front-end semiconductor device processes and wafer production plants. Atmospheric, vacuum, and waterproof environments; single- or twin-arm.

Devices that perform wafer centering and notch (orientation flat) alignment in front-end semiconductor device processes and wafer production plants.

Substrate transfer robots for front-end processes of liquid crystal (organic EL) etc. and glass substrate plants. Atmospheric/vacuum environments; single or twin arm.

Equipment for wafer supply to tools and sorting, with robots and peripheral devices. Used in front-end semiconductor device processes and wafer production plants.

Devices for manually removing thin wafers from wafer cases and wafer cassettes and storing them.

Atmospheric MultiLink SCARA wafer robot systems and WFH robot systems for semiconductor wafer and substrate handling, with pre-aligners and end-effectors.

Configurable EFEM in 2, 3 and 4 FOUP-wide sizes, used with Kensington robots, pre-aligners and FOUP load ports; includes a BOLTS interface.

Ball bonding equipment for semiconductor wire bonding applications, with automation and Industry 4.0 integration.

Wire and ribbon wedge bonding equipment for power semiconductors, automotive power modules and industrial power hybrids.

Thermo-compression bonding equipment for fluxless advanced packaging processes and heterogeneous integration.

Wafer-level bonders for advanced wafer-level packaging, supporting wire bonding and vertical applications.

Assembly equipment for high-power devices, including wide bandgap materials, used in automotive, renewable energy and electronics manufacturing.

Bonding tools (capillaries) for semiconductor packaging, supplied in standard designs and customized versions.