21 companies · 37 offerings

Detector, slide, push, rotary, power and dual-in-line package switches, including models for automotive use.

Tactile switches in snap-in, surface mount, radial and Contactsheet types. The range includes the SKTQ series for automotive use and the SKSW series for smartphones.

Rotary and slide potentiometers (variable resistors) used for volume control and air-conditioning control.

GNSS modules and GNSS tracker units for determining position and managing vehicle position in automotive applications.

Electromagnetic vibration actuators that produce tactile sensations, such as a clicking feel, for the mobile, gaming and automotive sectors.

Radar chipset (receiver, transmitter, RPU) scaling to 48 receive/48 transmit channels and 2,304 virtual channels, for automotive, heavy-machinery, industrial and counter-drone radar systems.

Design, development and supply of Electronic Control Units (ECUs) for the automotive sector and other industrial applications.

A family of pre-certified RF modules, cellular modems and LoRaWAN modules for IoT devices, in through-hole, surface-mount and micro form factors, programmable in MicroPython.

FPGA IP cores for GigE Vision, CoaXPress, CoaXPress-over-Fiber and USB3 Vision device and host implementations, compatible with AMD, Altera and Microchip PolarFire FPGAs.

FPGA IP cores for Sony Pregius Sub-LVDS and MIPI CSI-2 image sensors, providing sensor data deserialization and decoding, compatible with AMD FPGAs.

Optoelectronic products produced by HGTECH.

Magnetic and optical encoder ICs for position sensing, including interpolators and BiSS interface components.

Laser diode driver ICs, listed among the company's product focus areas alongside industrial sensor communication components.

Chip-based solutions tailored to individual customer applications, built on mixed-signal CMOS and power BCD processes.

RAIN RFID endpoint ICs (tag chips) for item tagging, including the M800, M700, M700 extended memory, Monza 4QT and Monza X-8K families. Monza R6P is a legacy line.

RAIN RFID reader ICs in the E900, E700, E500 and E300 series. They are used in fixed and handheld readers, point-of-sale devices, printers, kiosks and access-management systems.

Far-field, near-field and high-gain RFID antennas.

LS Mtron's electronic components business area.

ABLIC-brand ICs: power management ICs, memory, sensor and amplifier ICs, timer ICs, automotive ICs, healthcare ICs and CLEAN-Boost products.

MITSUMI-brand ICs: lithium-ion battery protection and related ICs, including fuel gauge ICs; power supply ICs (linear regulators and DC-DC converters); and reset ICs.

Power devices, optical devices and high-frequency devices.

Distribution of electronic components.

UHF band RFID tags for facility services and uniforms with wash-cycle durability, plus hard-shell, flexible and special (heat- and chemical-resistant) tags.

Optically isolated solid-state relays in power, Z, printed circuit and heat sink series. Available for 110-575 V and 3-45 A, with 4,000 V optical isolation.

Signal relays, power relays, PhotoMOS, safety relays with forcibly guided contacts, solid state relays, high-capacity DC cutoff relays and automotive relays.

PFN-designed processors for AI training and inference: MN-Core L1000 (generative AI inference), MN-Core 2 (AI training, HPC), and first-generation MN-Core.

Industrial differential power line drivers (OL7272LF, OL2068LF) from Numerik Jena, formerly OPTOLAB Microsystems. Quantum Devices is the sole North American distributor.

Buzzers, piezo elements and sirens; electret condenser and MEMS microphones; miniature speakers (10 to 40 mm) and standard speakers (41 to 205 mm). Custom audio solutions are also offered.

Power relays with 5 to 40 A maximum switching currents and signal relays with 2 or 3 A maximum switching currents.

DIP switches; anti-vandal, standard and miniature push button switches; slide switches; tactile switches with actuator heights from 0.35 to 17 mm.

AC fans, axial and centrifugal DC fans, BGA and board-level heat sinks, Peltier modules and cooling units, thermoelectric generator (TEG) modules, and thermal accessories.

Image sensors for industrial equipment covering visible, ultraviolet and infrared spectrums: global shutter, rolling shutter, polarization, UV, SWIR, ToF, event-based and multispectral types.

Image sensors for security cameras using STARVIS, STARVIS 2 or STARVIS 3 technology, for dark scenes and scenes with large differences in brightness.

Image sensors for automotive use, used in automotive camera and LiDAR systems, including a SPAD depth sensor for mobility LiDAR applications.

OLED microdisplays built on image-sensor backplane technology, used in camera EVFs, AR and VR headsets, FPV headsets, scopes, medical headsets and microscopes.

Semiconductor laser devices, including VCSELs, for 3D sensing and optical communication applications.

Multi-spectral area scan and line scan image sensors.