Brooks Automation
brooks.comVacuum substrate-transfer robots for semiconductor vacuum processing, including MagnaTran high-temperature robots and Leap vacuum robot platforms.
Vacuum substrate-transfer robots for semiconductor vacuum processing, including MagnaTran high-temperature robots and Leap vacuum robot platforms.
ACTRANS wafer transfer robots for vacuum and atmospheric environments, handling wafers up to 300 mm; the line also includes wafer aligners and FPD transfer robots.
Wafer handling robot for vacuum environments, listed in the ATM Robot (Display) line.
Robots for handling within flat panel display (FPD) processes and for transferring materials between process stages.
SCARA-type substrate handling robots for atmospheric front ends, with integrated controller and 3-axis motion. Models Hatm-4.0 and Hatm-5.0 carry payloads up to 0.5 kg.
Vacuum wafer-handling robot arms (HA-3.2, HA-5.0) for wafers up to 300 mm, used as the central handling robot in Constellation Systems. Payload is 2.5 kg standard or 4.5 kg high-load.
Atmospheric and vacuum wafer transfer robots for 300 mm wafers in low- and high-vacuum environments, plus robots for FOPLP.
Wafer transfer robots for front-end semiconductor device processes and wafer production plants. Atmospheric, vacuum, and waterproof environments; single- or twin-arm.
Substrate transfer robots for front-end processes of liquid crystal (organic EL) etc. and glass substrate plants. Atmospheric/vacuum environments; single or twin arm.
Atmospheric MultiLink SCARA wafer robot systems and WFH robot systems for semiconductor wafer and substrate handling, with pre-aligners and end-effectors.
Wafer transfer robots (main units), listed within Nidec's factory automation equipment category.
Direct drive vacuum robots for wafer and panel handling in semiconductor, power electronics, LED, FPD and packaging equipment, in dual, quad, side-by-side and single SCARA configurations.
Robots that move and load wafers of up to 12 inches in semiconductor manufacturing. They come in vertical, linear, standard, reverse and telescopic types.
Robots that transport, load, unload and align glass substrates from 2G (370x470) to 7G (1870x2000) in semiconductor and display manufacturing.
Robots that transfer semiconductor wafers, LCD/FPD glass, reticles/masks and FOUPs. Types include standard WTR, flip, telescopic, SCARA, Cartesian, wet, variable-pitch and vacuum robots.
Atmospheric wafer handling robots within RORZE's Wafer Handling System line, offered as models RR756L15, RR757L15 and RR759L27.
Vacuum wafer handling robots within RORZE's Wafer Handling System line, offered in the RR481, RR491, RR492 and RR493 model series.
Semiconductor wafer handling products: EFEM, Blade D and Blade S atmospheric robot hands, Loadport, SMIF, Aligner, and Mini STK.
RB100 Series robots for transferring wafers in semiconductor front-end equipment.
Atmospheric wafer transfer robots (ET-PLP, MTE, MTSR, TT301A series), pre-aligners (MAF-R, MAF-S series) and vacuum robots (MTP series) for semiconductor equipment and EFEMs.
Robots for wafer and substrate transport in vacuum environments, used in semiconductor manufacturing, coating systems and analytical instruments. Models: COVOT and ELEC-RZ.
Wafer transfer robot series for 2- to 12-inch wafers, atmospheric and vacuum models, for heat treatment, cleaning, etching, thin film, lithography, thinning, bonding.