173 companies · 452 offerings

Isolator-ready benchtop fill-finish units for early-stage drug development, including powder and liquid fillers, a cryovial filler, blister fillers and a rotary crimper.

Pilot-scale fill-finish equipment for drug products from clinical stages through to market approval, including a robotic fill-finish cell, cryovial filler and capsule fillers.

Commercial-scale production equipment for drug commercialisation, including a robotic fill-finish cell and DPI blister fillers.

Business area supplying systems for the forestry, specialized vehicle, mechanical engineering and electronics industries, including lumber dryers, log sorting systems and recycling systems.

Business area supplying solutions for measuring, controlling, cleaning and streamlining industrial flows, including emission control, Power-to-X and carbon capture systems.

Robotic system that dismantles wooden pallets, rated at 100 pallets per hour.

Lumber processing line that scans each board with a vision system for length, width and thickness, then trims and sorts it to preset dimensions. Rated at up to 32,400 boards per shift.

Systems for dispensing one- and two-component materials, micro-dispensers, PUR foam gasket technology, with integration into special-purpose machines and lines.

Equipment for several stages of battery manufacturing: raw material processing, cell assembly and finishing, testing and recycling.

Multi-Layer Furnace systems for press hardening of steel and hot forming of high-strength aluminum. Aluminum systems run on electricity or gas; TemperBox yields parts with hard and soft zones.

Ecoclear is an automated system that treats hydrodemolition wastewater on-site. It adjusts pH and removes suspended solids so water can be discharged or recirculated to the robot.

Semiconductor advanced packaging equipment covering laser dicing and grooving, fan-out bonding, thermo-compression bonding, hybrid bonding and ultra high precision die bonding (AMICRA series).

Semiconductor back-end equipment for IC and discrete devices: die attach, silver sintering, wire bonding, encapsulation, and singulation, trim & form.

Equipment for CMOS image sensor packaging covering die bonding, wire bonding, cleaning, AOI, lens attachment and active alignment.

SIPLACE SMT placement machines, including the SIPLACE V, SX, TX, X S and CA2 platforms; the CA2 combines bare-die and SMT component placement.

DEK stencil printers for SMT solder paste printing, including the DEK TQ, DEK TQ L, DEK NeoHorizon and DEK Galaxy models.

CAM-ACU in-factory coating system (Coating Application Module and Accelerated Curing Unit) for newly made conductors running at over 20 m per minute, plus manufacturing engineering services.

Dispensing systems within custom assembly machines that apply thermal paste, potting compounds, thread lock, adhesives, and UV materials to metal, glass, ceramic, and plastic parts.

Designs, engineers, manufactures and services aseptic containment and processing systems.

Laminating and coating systems (MPBL, MRBL, DBL) for spot and full-surface coating and for producing duplex and triplex laminates with hot melt adhesive systems.

Automated production solutions for energy storage systems, covering battery modules, battery packs, fuel cells and battery testing systems.

Fully automatic, semi-automatic, desktop, hybrid and laser PCB depaneling machines with dust collection systems, used for cutting on SMT and electronics lines.

Filling platforms for presterilized ready-to-use primary packaging such as syringes, vials and cartridges in nests, tubs or trays. Includes CombiSys, VarioSys, GENEX.

Systems for bulk processing of vials and cartridges in pharmaceutical production.

Modular and scalable filling platforms for syringes, vials and cartridges in RTU and bulk processing for commercial pharmaceutical production.

oRABS, cRABS and isolators as physical barriers for aseptic processes in pharma production, also for high-potent products, considering Annex 1 of the EU GMP guidelines.

Integration of isolator and filling process with a single point of contact, uniform batch reporting, uniform documentation, FAT solutions and lifecycle support.

Winding, needle winding and single-tooth winding machines for rotors and stators of electric motors.

Production machines for high-volume manufacturing of hairpin stators.

In-mould labelling systems that decorate plastic packaging during injection moulding, for cups, lids, buckets and trays from coffee capsules up to 60-litre buckets. Servo-driven.

Manufacturing systems for medical plastic injection-moulded parts, covering IML, take-out and downstream handling, with label adjustment and 100% visual quality control.

Standard IML machine for round, square, rectangular and oval pails and containers up to 30 L (1 cavity up to 30 L, 2 cavities up to 5 L).

IML line for cups, lids or bowls with 1- to 6-cavity moulds and lid-to-cup changeover in under one hour, for test centres, sampling and small-batch production.

Side-entry take-out systems for injection moulding machines that remove lids, cups or bowls at cycle times under 2 seconds, with optional optical inspection, reject sorting and stacking.

Datacon hybrid bonding systems for die attach in advanced packaging and 3D integration.

Thermo compression bonding (TCB) systems for advanced packaging applications.

Datacon 2200 evo series systems for die attach, multi-chip and flip chip applications.

Esec 2100 series die attach systems for semiconductor assembly.

Fully automated Esec soft solder die attach equipment for power semiconductor mass production.

Datacon and Esec flip chip systems for mass production and high-end applications, covering a range of flip chip processes.

Fico automatic and manual molding systems for semiconductor packaging.

Fico trim and form systems that cut and form semiconductor package leads.

Fico singulation machines for high volume semiconductor package separation.

Meco continuous plating and leadframe cleaning systems for leadframe, connector, solar cell and film and foil plating, with process chemistry and tooling.

Single-line and twin-line panel saws with blade cutting and mill cutting for panels made of wood and its derivatives.

Single-sided and double-sided edgebanders and squaring-edgebanding machines for panels made of wood and its derivatives.

Machining centres for milling, boring, nesting and shaped edgebanding of panels, and for producing door/window frames, stairs and other solid-wood parts.

Milling units, boring units and insertion devices for glue, dowels and hardware, for panels made of wood and its derivatives.

Calibrator-sanders for surface finishing, and clamping and assembly systems, for panels made of wood and its derivatives.

Machines for glass processing for the furniture, construction and automotive industries, including Intermac, Forvet and Bavelloni technologies.

Machines for stone processing for the furniture, construction and stone industries, including GMM technologies.

Polymers and composites processing solutions for automotive, aerospace, technical packaging and engineering plastics.

Modular tactical water purification systems, including the LWPS and MPRO 60HDX, that produce potable water from streams, lakes, rivers and oceans and are run by a single operator.

Machinery and plants for flat glass processing, from straight cutting machines up to float production lines.

Machinery for hollow glass production.

STAXX family of Automated Fiber Placement (AFP) systems (STAXX Box, ONE, COMPACT, 3D, Flex), plus preforming and composite handling for thermoplastic and thermoset materials.

Vacuum substrate-transfer robots for semiconductor vacuum processing, including MagnaTran high-temperature robots and Leap vacuum robot platforms.

Marathon vacuum systems, EFEM platforms, transport systems and sorter systems for handling wafer, panel and film-based substrates in semiconductor fabs and advanced packaging.

Load ports, EUV reticle load ports, SMIF and Versaport interfaces, and Auto ID systems for semiconductor tools. Install base of more than 10,000 300 mm load ports.

PuroMaxx carrier cleaning systems, PuroVision, PuroMetric and PuroSense inspection and metrology, and PuroView FOUP fleet management software for wafer carrier contamination control.

GuardianPro reticle storage systems and PuroMaxx 2 automated reticle handling for lithography operations. More than 1,000 systems deployed.

Bucher Emhart Glass supplies systems and automation technology for making and inspecting glass containers, and customer service named «Care», «Empower» and «Academy».

Full-volume and high-energy bead mills for wet grinding and dispersing in chemicals, cosmetics, electronic materials, paints and coatings, inks and batteries.

Steppers, scanners and nanoimprint lithography equipment that transfer circuit patterns from a mask to a wafer or panel. The lineup includes KrF and i-line models.

MPAsp Series mirror projection mask aligners for flat panel display lithography. Models handle Generation 6 (1,500 x 1,850 mm) and Generation 8 (2,200 x 2,500 mm) plates.

Vapor deposition equipment from the Canon group company Canon Tokki, used to produce OLED displays.