UP Bridge the Gap developer boards and edge computing devices, including the UP Squared, UP Xtreme and UP 7000 series, AI accelerators and development kits.
Computer-on-module product family in COM-HPC, COM Express, SMARC, Qseven, ETX and OSM form factors, for OEM carrier-board integration in embedded and edge-computing systems.
CompactPCI, CompactPCI Serial, VPX and PC/104 rugged computing boards and systems for railway, defense, aerospace and unmanned-systems applications, rated for -40C to 70C operation.
PICMG-standard computer-on-modules (single board with CPU, chipset, ECC memory and peripherals) for integration onto a carrier board, in COM-HPC, COM Express, SMARC and Qseven form factors.
Compute module bundled with Anvil robot devkits to run control, teleoperation, and data-collection software.
Industrial and embedded motherboards in ATX, EATX, Micro ATX, Mini ITX, Pico-ITX, 3.5-inch and Kiwi embedded form factors, plus embedded vision boards.
System-on-modules in COM Express Type 2, 6, 7 and 10, Qseven and SMARC form factors for embedded applications, with evaluation carrier boards for SMARC.
COM-HPC Computer-on-Modules in Server, Client and Mini variants, offered with carrier boards and cooling solutions.
COM Express Type 6, Type 7 and Type 10 Computer-on-Modules, from server designs with up to 100 W TDP to 84x55 mm Mini modules with low-power x86 processors.
SMARC Computer-on-Modules with x86 and Arm processors for space-constrained and in-vehicle applications, including AI applications at the edge.
Qseven Computer-on-Modules with x86 (Intel Atom, Pentium, Celeron) and Arm (NXP i.MX 8M Plus, i.MX6) processors, recommended by congatec for updates and upgrades of existing applications.
Single board computers for edge applications; the range includes the Pico-ITX conga-PA7 with Intel Atom x6000E, Pentium and Celeron J processors.
Robot development board with a 5 TOPS dual-core Bernoulli-architecture BPU, a quad-core ARM Cortex-A53 CPU at 1.5 GHz, 2GB or 4GB LPDDR4 RAM, and Ubuntu 20.04/22.04.
Robot development board with 10 TOPS AI compute, an 8-core A55 CPU at 1.5 GHz, 4GB or 8GB LPDDR4 RAM, CAN FD, PoE Gigabit Ethernet, two 4-lane MIPI CSI inputs, and Ubuntu 22.04.
Development kit for embodied intelligence in two variants: S100 (80 TOPS, 12GB LPDDR5) and S100P (128 TOPS, 24GB LPDDR5), each with 6x ARM Cortex-A78AE CPUs and 4x Cortex-R52+ MCU cores.
Wireless system-on-modules and single board computers built on NXP i.MX and ST STM32MP processors, supported by Digi Embedded Yocto Linux and Digi Embedded Android, for OEM product designs.
3.5-inch and 2.5-inch single board computers, Board-Line Arm-based CPU boards and PiXtend boards for industrial and commercial applications.
Arm-based systems-on-modules built on NXP, Texas Instruments and STMicroelectronics processors, used as the base for customized embedded products.
Compact edge AI computers and modules supported by the JetPack SDK, in the Thor, AGX Orin, Orin NX, Orin Nano, Xavier and TX2 series, for robotics and edge AI applications.
Industrial ATX, Micro-ATX and Mini-ITX motherboards, plus 3.5-inch, 2.5-inch Pico-ITX and 1.8-inch Femto-ITX single board computers with Intel and AMD Ryzen Embedded processors.
Computer-on-modules to the COM Express, COM-HPC, Qseven, SMARC and OSM standards, plus carrier boards, from Advantech and Axiomtek.
VPX, VME, CompactPCI and MicroTCA boards, XMC/PMC modules and enclosures from brands including Concurrent Technologies, TEWS Technologies and Kontron, for defense, aerospace and signal processing.
High-speed data acquisition and signal processing modules based on FPGAs, MPSoCs and GPUs, covering development, design, manufacturing, delivery and product life cycle services.
IoT board computer with six Arm Cortex-M4F cores, multi-system GNSS reception and a 192 kHz/24-bit audio codec; main board 50.0 x 20.6 mm.
Computer-on-module and system-on-module line comprising the ESOM-MT-1200, ESOM-MT-500 and ESOM-MT-350 modules.
Industrial single-board computers and motherboards in 5.25" (EXBC), 3.5" (EMBC), 2.5" (EPBC) and MicroATX (UMBC) form factors.