11 companies · 40 offerings

Semiconductor advanced packaging equipment covering laser dicing and grooving, fan-out bonding, thermo-compression bonding, hybrid bonding and ultra high precision die bonding (AMICRA series).

Semiconductor back-end equipment for IC and discrete devices: die attach, silver sintering, wire bonding, encapsulation, and singulation, trim & form.

Equipment for CMOS image sensor packaging covering die bonding, wire bonding, cleaning, AOI, lens attachment and active alignment.

Datacon hybrid bonding systems for die attach in advanced packaging and 3D integration.

Thermo compression bonding (TCB) systems for advanced packaging applications.

Datacon 2200 evo series systems for die attach, multi-chip and flip chip applications.

Esec 2100 series die attach systems for semiconductor assembly.

Fully automated Esec soft solder die attach equipment for power semiconductor mass production.

Datacon and Esec flip chip systems for mass production and high-end applications, covering a range of flip chip processes.

Fico automatic and manual molding systems for semiconductor packaging.

Fico trim and form systems that cut and form semiconductor package leads.

Fico singulation machines for high volume semiconductor package separation.

Fully automated assembly systems for optoelectronics and singulated photonic devices and PICs.

Development and batch processing platform that combines µm/sub-µm optical alignment with multiple bonding technologies.

Fully automated precision stacking and unstacking systems for semiconductor laser diode bars.

Thermo-compression (TC) bonder family for HBM production. Models listed: TC BONDER 4.5 GRIFFIN, 4.0 TIGER, 1.0 GRIFFIN, 1.0 TIGER; the family also lists HBM 6-SIDE INSPECTION 1.0.

2.5D thermo-compression bonder family. Models listed: 2.5D TC BONDER 120, 2.5D TC BONDER 40 C2S, 2.5D TC BONDER 40 C2W, BOC COB BONDER.

FC BONDER equipment family. Models listed: FC BONDER 3.0, FC BONDER 3.5, FC BONDER 5.0, FC BONDER 75.

VISION PLACEMENT equipment family, first developed by HANMI in 1998. Models listed: 6.0 GRIFFIN, 6.0D, 6.0L, 6.0T FAST, 8.0PS, 8.0UD, 8.0UL.

Semiconductor package cutting equipment family, launched in 2021. Eight models listed, including micro SAW W1121α, T2101, T1121, P2101 and GL2101.

EMI SHIELD equipment family listed in HANMI's equipment line-up; five models listed.

Grinding equipment family listed in HANMI's equipment line-up. Model listed: META GRINDER 1.0.

Laser equipment family. Models listed: LASER ABLATION 5.0, LASER MARK 3000S.

Fully automatic ultrasonic fine wire bonders (Bondjet BJ855–BJ885, BJ653) for wedge-wedge and ball-wedge bonding in HF/RF technology, COB, MCM, hybrids, optoelectronics and automotive electronics.

Ultrasonic heavy wire bonders (Bondjet BJ955, BJ959, BJ985, BJ931, BJ653, Lasersonic LSB959) for aluminum and copper wire or ribbon in automotive and power electronics.

Ball bonding equipment for semiconductor wire bonding applications, with automation and Industry 4.0 integration.

Wire and ribbon wedge bonding equipment for power semiconductors, automotive power modules and industrial power hybrids.

Thermo-compression bonding equipment for fluxless advanced packaging processes and heterogeneous integration.

Wafer-level bonders for advanced wafer-level packaging, supporting wire bonding and vertical applications.

Assembly equipment for high-power devices, including wide bandgap materials, used in automotive, renewable energy and electronics manufacturing.

Bonding tools (capillaries) for semiconductor packaging, supplied in standard designs and customized versions.

Die sorting systems that handle wafer, tape & reel, tray and panel formats with 6-side inspection, and carrier tape systems that link sorting to final packaging.

MRSI eutectic and epoxy die bonding systems, active alignment systems and epoxy dispensers for photonic and semiconductor applications, from R&D and NPI to high-volume manufacturing.

Vanguard Automation 3D nano-printing machines, materials and software for photonic wire bonding and facet-attached micro-optics between optical components.

Automated die bonders for precision die attach in microelectronic assembly. The family comprises the 3880-II, 6532HP and 6500 models.

Automated wire bonders for microelectronic assembly. The family comprises the 9000 Wedge Bonder and the 8100 Wire/Ball Bonder.

SST vacuum pressure soldering systems and furnaces for vacuum reflow. The family comprises the 8300 Series, 5100, 3130, 518 and the 1200 Table Top Furnace.

SST high vacuum furnaces. The family comprises the 3150 High Vacuum Furnace and the 3250 High Vacuum Wafer Furnace.

Equipment that places solder balls for high-density semiconductor packaging.

Flip chip hybrid placers: I-Cube10 and YSH20.