12 companies · 22 offerings

SIPLACE SMT placement machines, including the SIPLACE V, SX, TX, X S and CA2 platforms; the CA2 combines bare-die and SMT component placement.

DEK stencil printers for SMT solder paste printing, including the DEK TQ, DEK TQ L, DEK NeoHorizon and DEK Galaxy models.

Fully automatic, semi-automatic, desktop, hybrid and laser PCB depaneling machines with dust collection systems, used for cutting on SMT and electronics lines.

モジュールコンセプトを採用した電子部品実装機。ヘッドは1アクションで交換できる。AIMEXR、NXTR（Sモデル・Aモデル）、AIMEX III、AIMEX IIIc、NXT-Hのシリーズで構成される。

ベースから印刷部まで一貫した高剛性設計を採用した基板用印刷機。対象は小型基板の超微細パターンから多層大型基板まで。NXTR PMとGPXシリーズで構成される。

小型から大型までのリード付電子部品を自動で挿入する装置。sFAB-D、sFAB-SH、SmartWing BAで構成される。

Modular mounters that place electronic components on printed circuit boards; the line includes the LX-8, RS-2, RX-8 and RS-1XL.

RP series solder paste printers for the pre-process stage of SMT production lines.

JM series multi-task platforms that automate post-process insertion of large and odd-shaped components on printed circuit boards.

Ersa reflow, selective and wave soldering systems, temperature profiling systems, and solder, flux and consumables for electronics manufacturing.

Stencil printers with integrated 100% post-print SPI for circuit board production.

Ersa rework systems for electronic assembly repair and rework applications.

Consumer electronics equipment for vision metrology, AI cosmetic inspection, 5-axis dispensing, 3D inkjet and pad printing, test and 3D assembly, for mobile phones, smart watches and VR glasses.

Production systems for HF/NFC and UHF RFID: antenna production, inlay assembly by direct chip attach or strap technology, converting, and encoding and personalization.

SMT manufacturing machines and software for PCB assembly: stencil printing, jet printing, component placement, AOI, solder paste inspection, component storage and process software.

SMD assembly machines, stencil printers, reflow ovens, wave soldering, depanelizers, AOI/SPI inspection, conveyors, screw feeders and laser marking. Brands include Yamaha, Neoden and Heller.

Stand-alone and inline machines for separating printed circuit boards with electronic components, plus laser depaneling and workpiece holders. Built by SCHUNK Electronic Solutions GmbH.

Surface mount component placement machines (YRM10, YRM20, YRM20DL, YSM10) in single-lane and dual-lane modular configurations, with ALF self-loading feeder and LCR checker accessories.

Solder paste printers for SMT lines: YRP10 with full auto changeover and YCP10 compact printer.

YRM-D air-pulsed dispenser for PCBs from L50 x W50 mm to L510 x W460 mm, with 0.07 s/shot cycle and ±0.05 mm dispensing accuracy.

YST15 automated storage and refill management for surface mounter component reels; standard model stores up to 1,500 7-inch reels, with humidity management and linking of up to 99 units.

Surface mount machines that mount electronic components on printed circuit boards. Consist of the YRM20DL, YRM20, and YRM10 models and auto loading feeders.